Mechanically connected semiconductor laser device stack array

Abstract

The invention provides a mechanically connected semiconductor laser device stack array which consists of multiple semiconductor laser device units, wherein the semiconductor laser device units are provided with recess parts and groove parts; the recess parts are matched with the groove parts, so that the recess parts and the groove parts of every two adjacent semiconductor laser device units are connected in a plugging manner to form a stack array structure. According to the mechanically connected semiconductor laser device stack array, the semiconductor laser device units are assembled in an interference fit plugging manner, so that lossless removal of the semiconductor laser device units can be realized; furthermore, a relatively small size can be also realized, and heat dissipation of a product is facilitated.

Description

technical field [0001] The invention relates to a semiconductor laser, in particular to a packaging structure of a stacked array of mechanically connected semiconductor lasers. Background technique [0002] figure 1 It is an existing high-power semiconductor laser stacked packaging structure: after multiple laser chips 1 and multiple heat-dissipating conductive substrates 2 are bonded into a bar group, they are bonded on the insulating structure 4 as a whole, and then the The module is bonded on the heat sink; or the laser chip is bonded to the conductive substrate to form a light emitting unit, and multiple light emitting units are bonded to the insulating substrate and the heat sink in turn. [0003] In the semiconductor laser stack structure of the above packaging structure, the laser chips, conductive substrates, insulating substrates and heat sinks are all bonded to each other. If one chip burns out, the entire stack will fail; and the structure The post-maintenance o...

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Problems solved by technology

[0003] In the semiconductor laser stack structure of the above packaging structure, the laser chips, conductive substrates, insulating substrates and heat sinks are all bonded to each other. If one chip burns out, the entire stack will fail; and the structure The post-maintenance of semiconductor lasers is complicated, and the failure of a single chip in long-term use is difficult to repair and replace alone, which in turn affects the reliability of the entire semiconductor laser

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