Improved impedance PCB

Abstract

The invention provides an improved impedance PCB. By using a basic layer in the invention, a dielectric constant of the PCB using the basic layer can be effectively reduced and PCB impedance control is improved. Through combining an impedance layer material provided in the invention, and through a compound synergy effect of each component, compared to the PCB which has a same thickness structure and uses traditional glass fiber fabric, the PCB of the invention possesses a lower dielectric constant.

Description

technical field [0001] The invention belongs to the technical field of PCB processing, and in particular relates to a PCB board with improved impedance. Background technique [0002] With the diversification and development of electronic products, the number of circuit boards involving linear impedance control is gradually increasing. Linear impedance is simply the resistance value at both ends of the wire, which is related to the length of the wire, copper thickness, and wire width. The thickness of the wire is the key influencing factor. [0003] At present, the materials used in printed circuit boards in the industry mainly use glass fiber cloth (referred to as glass fiber cloth) as the reinforcing material. This kind of glass fiber cloth has a grid structure of warp and weft yarns, and the glass fiber content varies greatly between the warp and weft yarn interweaving points and the middle of the space. , so that the resin content is low and uneven when coating the resin,...

AI Technical Summary

Problems solved by technology

[0003] At present, the materials used in printed circuit boards in the industry mainly use glass fiber cloth (referred to as glass fiber cloth) as the reinforcing material. This kind of glass fiber cloth has a grid structure of warp and weft yarns, and the glass fiber content varies greatly between the warp and weft yarn interweaving points and the middle of the space. , so that the resin content is low and uneven when coating the resin, and the dielectric constant of the plate dielectric layer is high due to the structural problems of the glass fiber cloth itself. If the printed circuit board needs to be lower under the same dielectric thickness If the dielectric constant is higher, then it is necessary to use a thinner glass fiber cloth bonding sheet, but its disadvantage is that the cost is high, which is not conducive to lamination processing

As the current transmission frequency of electrical signals is getting higher and higher, the requirements for the dielectric constant of the board are lower, but because the structure of the glass fiber cloth itself has not undergone fundamental changes, it still cannot meet the current signal transmission rate of the high-frequency bottom line and signal integrity requirements