Manufacturing method of printed circuit board

Abstract

The invention discloses a manufacturing method of a printed circuit board, wherein the method includes steps of S1, providing a circuit board substrate, and punching the setting position of the circuit board substrate; S2, printing both sides and the plane of the substrate by bonding glue; S3, respectively bonding conductive layers at bonding glues at both sides, correspondingly arranging the hole positions of the conductive layer and the base material, sealing the outer edges of the substrate and the outer edge of the conductive layer; S4, overlapping the conductive layer and the substrate, heating and laminating every conductive layer and the substrate; pressing the bonding glues and completely filling the bonding glues in the hole positions of the conductive layer and the base material; S5, grinding and removing the overflowed residual glue of the hole position of the conductive layer, cleaning and drying the hole face. The manufacturing method can avoid the glue overflow at the outside of the circuit board, and guarantee the complete glue filling in the hole position of the circuit board.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, in particular to a method for manufacturing a printed circuit board. Background technique [0002] The printed circuit board is the carrier that provides various components for electrical connection. With the gradual complexity of electronic equipment, more and more components need to be used. With a larger wiring area, the difficulty of wiring can be greatly reduced. The base material of the printed circuit board itself is made of insulating and heat-insulating materials. Copper foil covers the surface of the printed circuit board, and part of the copper foil is etched away during the manufacturing process, leaving small lines as wires. In order to fix the components on the surface of the printed circuit board, it is necessary to directly solder the pins of the components to the wires. The components are concentrated on one side of the printed circuit board, and the wires are conc...

AI Technical Summary

Problems solved by technology

In order to fix the components on the surface of the printed circuit board, it is necessary to directly solder the pins of the components to the wires. The components are concentrated on one side of the printed circuit board, and the wires are concentrated on the other side. The hole is convenient for the pins on one side to penetrate to the other side to realize the interconnection of the wires. During the screen printing step of injecting the conductive copper glue into the through hole of the substrate with a scraper, the conductive copper glue in the through hole is affected by the concave and convex surface of the substrate surface. The amount of injected lead leads to quality defects; when multi-layer circuit boards are pressed together, the adhesive glue in the middle layer overflows towards the outer edge due to external force, which can easily cause holes to leak and fail to fill the holes, and the overflowing glue will cause pollution In turn, it affects the performance of the circuit board, affects the conductivity and positioning, and causes a decline in the yield rate