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Polyamic acid solution, polyamic acid composition and polyimide film

A technology of polyimide film and polyamic acid, which is applied in the field of materials, can solve problems such as poor dimensional stability, and achieve the effect of improving dimensional stability and rigidity

Active Publication Date: 2022-02-11
株洲时代华鑫新材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the disadvantages of poor dimensional stability of polyimide films in the prior art, and provide a polyimide film product with higher dimensional stability

Method used

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  • Polyamic acid solution, polyamic acid composition and polyimide film
  • Polyamic acid solution, polyamic acid composition and polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Add 18kg of ODA and 2.16kg of 3,3'-dihydroxybenzidine (hereinafter referred to as DHB) into 168kg of N-methylpyrrolidone (hereinafter referred to as NMP) and heat to 35°C for 2 hours to fully dissolve, then divide into three times (60wt %, 30wt%, 10wt%), add 21.8kg of pyromellitic dianhydride (hereinafter referred to as PMDA), react for 6h to generate a polyamic acid solution with a viscosity of 200000cp, cool to 0°C, add 20.98kg of benzoic anhydride, 10.49kg picoline to obtain a polyamic acid composition.

[0032] The polyamic acid composition was defoamed and cast onto a steel belt, heated at 180°C for 8 minutes to remove the solvent, imidized at 250°C for 4 minutes, 400°C for 3 minutes, and 550°C for 2 minutes. A polyimide film of 25 μm was obtained.

Embodiment 2

[0034] Repeat the steps of Example 1, and change the weight of each component to: 14kg of ODA, 6.48kg of DHB, 21.8kg of PMDA, 232.54kg of DMAC, 42.28kg of acetic anhydride, 12.69kg of imidazole, and the polyamic acid solution is cooled to -16 ℃.

Embodiment 3

[0036] Repeat the steps of Example 1, change the weight of each component to: ODA of 10kg, DHB of 10.8kg, PMDA of 21.8kg and DMF of 102.24kg, 13.63kg propionic anhydride, 11.93kg tripropylamine, the polyamic acid solution is cooled to- 10°C.

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Abstract

The present invention relates to a polyamic acid solution, a polyamic acid composition, and a polyimide film obtained from the polyamic acid solution or polyamic acid composition. The CTE (100 ℃~200 ℃) of the polyimide film of the present invention is close to copper foil, reaches 16~25ppm / ℃, and the thermal shrinkage rate of the polyimide film of the present invention is within 0.03%, which is different from that of the prior art Compared with the polyimide film, it has better dimensional stability.

Description

technical field [0001] The invention belongs to the technical field of materials, and specifically relates to a polyamic acid solution, a polyamic acid composition, and a polyimide film obtained from the polyamic acid solution or the polyamic acid composition. Background technique [0002] The traditional polyimide film production method is divided into two steps: the first step is to synthesize polyamic acid (PAA) using pyromellitic dianhydride and diaminodiphenyl ether; the second step is to synthesize polyamic acid prepolymer The film is coated and imidized at a high temperature of 300°C to 400°C to finally obtain a polyimide film. The film produced by this process has poor dimensional stability and can only be used in low-end fields such as insulating tapes. With the continuous development of the market and the continuous advancement of technology, the demand for polyimide films in the electronic field such as FCCL has increased greatly , occupying more than 80% of the P...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08L79/08C08J5/18
CPCC08G73/1067C08G73/1071C08J5/18C08L79/08C08J2379/08C08L2203/16
Inventor 张步峰廖波钱心远余相仁王亚辉
Owner 株洲时代华鑫新材料技术有限公司