Polyamic acid solution, polyamic acid composition and polyimide film
A technology of polyimide film and polyamic acid, which is applied in the field of materials, can solve problems such as poor dimensional stability, and achieve the effect of improving dimensional stability and rigidity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0031] Add 18kg of ODA and 2.16kg of 3,3'-dihydroxybenzidine (hereinafter referred to as DHB) into 168kg of N-methylpyrrolidone (hereinafter referred to as NMP) and heat to 35°C for 2 hours to fully dissolve, then divide into three times (60wt %, 30wt%, 10wt%), add 21.8kg of pyromellitic dianhydride (hereinafter referred to as PMDA), react for 6h to generate a polyamic acid solution with a viscosity of 200000cp, cool to 0°C, add 20.98kg of benzoic anhydride, 10.49kg picoline to obtain a polyamic acid composition.
[0032] The polyamic acid composition was defoamed and cast onto a steel belt, heated at 180°C for 8 minutes to remove the solvent, imidized at 250°C for 4 minutes, 400°C for 3 minutes, and 550°C for 2 minutes. A polyimide film of 25 μm was obtained.
Embodiment 2
[0034] Repeat the steps of Example 1, and change the weight of each component to: 14kg of ODA, 6.48kg of DHB, 21.8kg of PMDA, 232.54kg of DMAC, 42.28kg of acetic anhydride, 12.69kg of imidazole, and the polyamic acid solution is cooled to -16 ℃.
Embodiment 3
[0036] Repeat the steps of Example 1, change the weight of each component to: ODA of 10kg, DHB of 10.8kg, PMDA of 21.8kg and DMF of 102.24kg, 13.63kg propionic anhydride, 11.93kg tripropylamine, the polyamic acid solution is cooled to- 10°C.
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 

