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A wiring method and chip module

A technology of chip module and wiring method, applied in the field of manufacturing process, can solve the problem of large occupied area of ​​FCPB

Active Publication Date: 2018-11-30
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present invention provides a wiring method and a chip module to solve the problem that the FCPB in the chip module occupies a large area in the prior art

Method used

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  • A wiring method and chip module
  • A wiring method and chip module
  • A wiring method and chip module

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Experimental program
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no. 1 example

[0023] The embodiment of the present invention provides a wiring method, such as Figure 4 shown, including:

[0024] Step 401, forming a plastic base by injection molding.

[0025] In the embodiment of the present invention, the plastic base is made of a modified plastic containing an organic metal compound through an injection molding process.

[0026] Wherein, the plastic base provided by the embodiment of the present invention may be a base for setting a camera chip, or a base for setting a fingerprint chip. Of course, it can be understood that other bases capable of implementing the LDS process seat.

[0027] Step 402 , using a laser to activate a preset position on the plastic base to form an activated surface.

[0028] In the embodiment of the present invention, the injection-molded plastic base, under the action of laser excitation, will open the chemical bonds of the modified plastic, and the metal particles in the modified plastic will be exposed. Therefore, in th...

no. 2 example

[0036] The embodiment of the present invention provides a chip module, such as Figure 5 and Figure 6 As shown, it includes: a plastic base 501 , a chip 502 disposed on the plastic base 501 , a flexible circuit board (ie FPCB) 503 electrically connected to the chip 502 and a connector 504 electrically connected to the flexible circuit board 503 .

[0037] Among them, the plastic base 501 is provided with a plurality of first circuits 505 formed by laser direct structuring technology (LDS), and the flexible circuit board 503 is provided with a second circuit corresponding to the first circuit 505, and the first circuits 505 are respectively It is electrically connected to the corresponding signal pin on the chip 502 and the corresponding second line.

[0038] The embodiment of the present invention uses the LDS process to carry out wiring on the plastic base 501, and then the lines formed on the plastic base 501 are electrically connected to the lines on the FPCB, so that the...

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Abstract

The present invention provides a wiring method and a chip module. The wiring method comprises the steps of forming a plastic base through injection molding; forming an activated surface on the preset part of the plastic base through laser activation; placing the plastic base in a copper plating solution, and overspreading the activated surface with copper in the copper plating solution to form a wiring circuit. According to the technical scheme provided in the embodiment of the invention, the wiring is conducted on the plastic base of the chip module by utilizing the LDS technology. After that, a circuit formed on the plastic base is electrically connected with a circuit formed on the FPCB. Therefore, the occupied area of a long-distance circuit on the FPCB is reduced, so that the area of the FPCB is reduced. The occupied space of the chip module relative to a mobile terminal is also saved.

Description

technical field [0001] The invention relates to the field of manufacturing technology, in particular to a wiring method and a chip module. Background technique [0002] As the mobile terminal has more and more functions, in order to support the realization of the functions, there are more and more hardware structures in the mobile terminal. In the existing technology, such as Figure 1 to Figure 3 As shown, a part of the chip module includes: a plastic base 101, a chip 102 arranged on the plastic base 101, a flexible circuit board 103 (Flexible Printed Circuit Board, referred to as FPCB) electrically connected to the chip 102, and an electrical connection with the flexible circuit board 103. connected connector 104 . Among them, the signal lines coming out from different positions of the chip have different routings on the FPCB board. For example, the signal lines coming out of the chip away from the connector generally have a long wiring distance, and may need to avoid oth...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/488
Inventor 杨卓坚肖强
Owner VIVO MOBILE COMM CO LTD