Heat dissipation device of camera control main board and camera device

Abstract

The invention discloses a heat dissipation device of a camera control main board and a camera device. The heat dissipation device comprises heat dissipation silica gel and a heat dissipation fin. The heat dissipation silica gel is attached to the surface of the camera control main board away from the camera. The heat dissipation fin is disposed on the heat dissipation silica gel, and the edge position of the heat dissipation fin is provided with a heat dissipation plate extended along the direction opposite to the direction of the camera, and then the heat dissipation area of the heat dissipation fin is increased. The heat dissipation silica gel is disposed on the camera control main board, and the heat dissipation fin is disposed on the heat dissipation silica gel, and therefore the effective heat conduction area between the camera control main board and the heat dissipation fin is effectively increased, the heat dissipation silica gel has good heat conduction effect, and the heat conduction rate between the heat dissipation fin and the camera control main board is enhanced. The heat dissipation plate extended from the heat dissipation fin is used to effectively increase the heat dissipation area of the heat dissipation fin, and therefore the heat dissipation efficiency of the heat dissipation device is improved. The heat dissipation device is smart and noiseless, and is suitable for the heat dissipation requirement of the camera.

Description

technical field [0001] Embodiments of the present invention relate to the field of heat conduction, in particular to a heat dissipation device for a camera control board and a camera. Background technique [0002] With the development of mobile communication, computer and Internet technology, image acquisition technology has been greatly developed. As people have higher and higher requirements for video clarity, the camera's shooting clarity and picture quality are getting higher and higher. The shooting clarity and shooting quality of the camera are related to the processing capability of the main control chip, and the processing speed of the main control chip is closely related to the heat dissipation rate of the cooling device it has. [0003] In the prior art, there are mainly two heat dissipation principles of the heat dissipation device provided: one is water-cooled heat dissipation, and the other is air-cooled heat dissipation. Among them, the water-cooled heat dissi...

AI Technical Summary

Problems solved by technology

Among them, the water-cooled heat dissipation is to lay a pipe filled with heat-absorbing liquid on the main board installed with the main control chip, and dissipate heat by making the heat-absorbing liquid flow. The water-cooled heat dissipation has a strong heat dissipation capacity, but requires a large The heat dissipation space can make it play a role; the air-cooled heat dissipation is to attach the heat sink made of heat dissipation material to the main board installed with the main control chip, and drive the airflow in the internal space to flow through the fan to dissipate heat. The heat dissipation can be applied to the heat dissipation in a small space, but because the air-cooled heat dissipation adopts the fan rotation method to dissipate heat, it is easy to generate noise, and it cannot be reduced to a size that can be used in a camera

[0004] The inventors of the present invention found in the research that the water-cooled heat sink in the prior art takes up a lot of space; while the air-cooled heat sink generates a lot of noise during operation and also requires a certain installation space, so it cannot for camera

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