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Encapsulation module for surface mounted RGB-LED (Red, Green, Blue-Light Emitting Diode) and manufacturing method thereof

A technology of RGB-LED and manufacturing method, which is applied in the direction of identification devices, instruments, semiconductor devices, etc., can solve the problems of low mechanical strength of products, high production difficulty, low production efficiency of SMD RGB LEDs, etc., to improve the resistance to external mechanical strength. Ability, low maintenance cost, not easy to be corroded by water vapor

Active Publication Date: 2017-06-13
SHANDONG JIERUNHONG OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a surface-mounted RGB LED packaging module and its manufacturing method, aiming to solve the problems of low production efficiency, high production difficulty, and low mechanical strength of the existing SMD RGB LED products.

Method used

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  • Encapsulation module for surface mounted RGB-LED (Red, Green, Blue-Light Emitting Diode) and manufacturing method thereof
  • Encapsulation module for surface mounted RGB-LED (Red, Green, Blue-Light Emitting Diode) and manufacturing method thereof
  • Encapsulation module for surface mounted RGB-LED (Red, Green, Blue-Light Emitting Diode) and manufacturing method thereof

Examples

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Effect test

Embodiment 1

[0058] see image 3 - Fig. 8 is a 1*2 surface mount RGB LED packaging module provided by the present invention. The packaging module has two light emitting units. In actual production, such as Figure 4 and Figure 7 As shown, an isolation frame 9 may also be provided around the light emitting units to reduce the influence between the light emitting units. Preferably, as Figure 5 As shown, on the reverse side of the substrate 1, an identification area 101 may be provided in the middle of each light-emitting unit to facilitate subsequent testing and packaging equipment to identify the front and back sides of the packaging module. Such as Figure 6 and Figure 7 As shown, a protective layer 8 can also be provided on the light-emitting unit. The protective layer 8 is preferably a translucent epoxy resin adhesive layer with a diffusing agent. The setting of the protective layer 8 can prevent the entry of water vapor and prevent components from subject to mechanical damage....

Embodiment 2

[0060] see Figure 9-Figure 1 1. It is a 1*3 surface-mounted RGB LED package module provided by the present invention, and the package module has three light-emitting units. The structure of the light-emitting unit is the same as that of the light-emitting unit in Embodiment 1. Such as Figure 11a and Figure 11b As shown, 24 light-emitting units are arranged on the substrate 1, distributed in 4 rows and 6 columns. Such as Figure 11b As shown, the cutting line 7 divides the substrate 1 into eight packaging modules, and the plating circuit 6 is also arranged on the cutting line 7 . All the plating circuits 6 in this embodiment are arranged on the front side of the substrate 1 . All the upper pads 2 are connected to the nearby electroplating circuit 6 at the position of the cutting line 7 through the electroplating circuit 6. When cutting the substrate 1, all the electroplating circuits 6 at the position of the cutting line 7 are cut off. The disks 2 are thus independent o...

Embodiment 3

[0062] Figure 12-Figure 14 Another 1*3 surface-mounted RGB LED package module provided by the present invention has three light-emitting units on all package modules, but the arrangement of the light-emitting units is different from that in Embodiment 2. In this embodiment, the three light emitting units are arranged in an inverted "L" shape, and the present invention does not limit the arrangement of the light emitting units. Such as Figure 14 As shown, the electroplating circuit of this embodiment is arranged on the front of the substrate 1, and the position of the cutting line 7 also has the electroplating circuit 6, and all the upper pads 2 are electrically connected to the electroplating circuit 6 at the position of the cutting line 7. For the specific connection method, This embodiment is not limited.

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Abstract

The invention provides an encapsulation module for a surface mounted RGB-LED (Red, Green, Blue-Light Emitting Diode) and a manufacturing method thereof. The encapsulation module comprises a substrate and light emitting units, wherein the light emitting units are arranged on the substrate; the light emitting units are provided with protective layers; the quantity of the light emitting units is at least two; each light emitting unit comprises four mutually independent upper bonding pads and one group of RGB LED chips; the RGB LED chips are arranged on any one upper bonding pad, and are connected with the other three upper bonding pads through keys and lines; the upper bonding pads are provided with metallic holes which pass through the substrate and are conductively communicated up and down; the positions, corresponding to the metallic holes, of the reverse surface of the substrate are provided with lower bonding pads; the lower bonding pads are mutually independent. By using the encapsulation module, multiple light emitting units are integrated in one encapsulation module; the production efficiency of an LED in subsequent application and production is greatly improved; the production cost is greatly decreased.

Description

technical field [0001] The invention relates to SMD LED packaging technology, in particular to a surface-mounted RGB LED packaging module and a manufacturing method thereof. Background technique [0002] With the continuous development of the display industry, display LEDs have changed from the original DIP (dual inline-pinpackage, dual inline packaging technology) structure to the SMD (Surface Mounted Devices, surface mount device) structure at a high speed. LED has the advantages of light weight, smaller body, automatic installation, large luminous angle, uniform color, and low attenuation, and is more and more accepted by people. Although general SMD LEDs have the above advantages, they still have large attenuation, long heat conduction path, Low carrying current, complex production, low reliability, low moisture resistance, poor weather resistance and other issues. If the reliability of the product is to be improved without changing the overall structure of the product,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/075H01L33/62G09F9/33
CPCH01L25/0753H01L33/62G09F9/33H01L33/486H01L2933/0033H01L2933/0091H01L33/56H01L2933/0066H01L2224/97H01L2224/48227H01L25/50H01L33/44
Inventor 李邵立孔一平袁信成
Owner SHANDONG JIERUNHONG OPTOELECTRONICS CO LTD
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