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Tray assembly

A tray and component technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, discharge tubes, etc., can solve problems such as difficult adsorption of sapphire substrates, achieve good fixation and avoid damage effects

Active Publication Date: 2017-06-16
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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AI Technical Summary

Problems solved by technology

[0007] The present invention aims to solve at least one of the technical problems in the prior art, and proposes a tray assembly, which can absorb the substrate with a small voltage under the premise of achieving good fixation of the substrate, thereby avoiding the tray In the case of component damage, the problem of difficult adsorption of sapphire substrates is solved

Method used

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Embodiment Construction

[0023] In order to enable those skilled in the art to better understand the technical solution of the present invention, the tray assembly provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0024] The tray assembly provided by the present invention includes a tray main body and a cover plate for carrying multiple substrates. Wherein, a DC electrode is arranged in the main body of the tray, and the DC electrode is electrically connected to a DC power supply. The cover plate is arranged on the main body of the tray, and presses the edge area of ​​the upper surface of each workpiece to be processed; and the cover plate is made of conductive material to generate electrostatic attraction between the DC electrode and the cover plate.

[0025] Since the cover plate is made of conductive material, this can generate electrostatic attraction between the DC electrode and the cover plate, and the cover plate can be fixed by...

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Abstract

Provided is a tray assembly, which comprises a tray main body for bearing a plurality of substrates, and a cover plate. The tray main body is internally provided with a DC electrode. The DC electrode is electrically connected with a DC power supply. The cover plate is arranged on the tray main body and presses an edge area of the upper surface of each workpiece to be processed; and the cover plate is made of a conductive material to generate electrostatic attraction between the DC electrode and the cover plate. The tray assembly can absorb the substrates through a relatively-small voltage under the condition of realizing good fixation of the substrates, thereby preventing the case of damage to the tray assembly and solving the problem of difficult adsorption of the sapphire substrates.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a tray assembly. Background technique [0002] With the continuous development of microelectronics technology, the competition of related production enterprises is becoming more and more fierce. Reducing costs and improving production efficiency are common means to improve the competitiveness of enterprises. For example, in order to improve production efficiency and reduce production costs, LED light source manufacturers usually use trays to carry multiple sapphire substrates at the same time during the patterned sapphire substrate (Patterned Sapphire Substrates, hereinafter referred to as PSS) etching process to cope with the increasing market demand. [0003] In practical applications, the tray containing the sapphire substrate is usually brought into the process chamber by a robot, and placed on the lower electrode of the plasma etching equipment. In order to avoid...

Claims

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Application Information

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IPC IPC(8): H01L21/683H01J37/32
CPCH01J37/32715H01L21/6833
Inventor 张宝辉张伟涛栾大为王伟
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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