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SFP28 optical module

A technology of optical modules and lasers, which is applied in the field of SFP28 optical modules, can solve the problems of high cost of packaging components and complicated packaging process, and achieve the effects of reducing production costs, shortening process flow, and reducing design work

Pending Publication Date: 2017-06-20
WUHAN FIBERPON TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a FP28 optical module with simple structure and easy implementation, which solves the problems of complicated packaging process and high cost of packaging components in the existing SFP28

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Embodiment Construction

[0023] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0024] Such as figure 1 As shown, an SFP28 optical module includes a housing and a golden finger arranged on the housing. A circuit part and an optical circuit part are arranged in the housing. The circuit part includes: an MCU controller and a main chip; the optical circuit part includes: a light emitting component and an optical Receiving component; integrated laser drive circuit, limiting amplifier circuit, first clock data recovery circuit and second clock data recovery circuit in the main chip; optical transmitting component includes: directly modulated laser packaged by TO-CAN process; optical receiving component includes : photodiode and transimpedance amplifier; MCU controller is connected with the main chip...

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Abstract

The invention relates to an SFP28 optical module. The optical module comprises a shell and a connecting finger arranged on the shell, wherein a circuit part and an optical path part are arranged in the shell; the circuit part comprises an MCU controller and a main chip; the optical path part comprises an optical transmitting component and an optical receiving component, and the main chip is integrated with a laser drive circuit, a limiting amplifier circuit, a first clock data recovery circuit and a second clock data recovery circuit; the optical transmitting component comprises a direct modulation laser; and the optical receiving component comprises a photodiode and a transimpedance amplifier. According to the SFP28 optical module disclosed by the invention, the circuit part of the optical module is integrated in the main chip, and thus the design operation of the circuit board can be reduced, the interaction effect of the devices and circuits can be reduced, and the technological process can be shortened; and meanwhile, the laser is no longer encapsulated by using a hermetically sealed gold box, but adopts a TO-CAN process for encapsulation, and thus a simple process can be provided, the heat dissipation problem can be more effectively solved, the manufacture cost can be reduced, and the practicability can be increased.

Description

technical field [0001] The invention relates to an optical module transceiver system, in particular to an SFP28 optical module. Background technique [0002] The existing SFP28 solutions put the driver chip in the gold box (that is, the BOX package), but the 25Gbps laser chip is very afraid of heat, which brings challenges to the heat dissipation design. The SFP28 module supports the 25G Ethernet standard, and the SFP28 can Provide 25Gbit / s error-free transmission, the transmission distance can reach 10KM in single-mode fiber, and can be applied to high-density 25G Ethernet equipment and network interfaces. As the market transitions from 10Gbps to 25Gbps per lane, the demand for SFP28 modules will increase significantly in the next five years Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an FP28 optical module with simple structure and easy implementation, which solves the problems of complicated packaging pro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B10/40H04B10/50
CPCH04B10/40H04B10/504
Inventor 侯平胜
Owner WUHAN FIBERPON TECH
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