Separation device and separation method

A separation equipment and separation method technology, applied in the field of flexible device manufacturing technology, can solve the problems of long time consumption, affecting production efficiency and product yield, and achieve the effects of reducing separation time, improving product yield, and simplifying equipment mechanism

Active Publication Date: 2017-06-23
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the need for an alignment step before separation, it takes a long time, and at the same time, alignment failure will inevitably occur, which will affect production efficiency and product yield

Method used

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  • Separation device and separation method
  • Separation device and separation method

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Embodiment Construction

[0031] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art fall within the protection scope of the present invention.

[0032] In order to solve the problem that the alignment step is required when separating the rigid carrier substrate and the protective film in the prior art, the edge separation takes a long time, and the alignment failure easily damages the rigid carrier substrate and flexible devices, please refer to figure 1 with figure 2 , An embodiment ...

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Abstract

The invention provides a separation device and a separation method. The separation device is used for separating a device to be separated. The device to be separated comprises a rigid carrier substrate, a flexible device arranged on the rigid carrier substrate, and a protective film which covers the flexible device. The four edges, which do not cover the flexible device, of the protective film fit the rigid carrier substrate. The separation device comprises a base used for placing the device to be separated, an air knife, and an air knife control member which is used for controlling the air knife to blow the boundary of at least one edge of the protective film and the fit surface of the rigid carrier substrate. The protective film is separated from the rigid carrier substrate. According to the invention, when the rigid carrier substrate and the flexible device are separated by the separation device, the separation time can be reduced without causing damage to the rigid carrier substrate and the flexible device.

Description

Technical field [0001] The invention relates to the field of flexible device manufacturing technology, in particular to a separation equipment and a separation method. Background technique [0002] In the manufacturing process of flexible OLED (organic light emitting diode) devices, a rigid carrier substrate is usually provided first, and then a flexible device is formed on the rigid carrier substrate. The flexible device usually includes a flexible substrate and an OLED device arranged on the flexible substrate. After the flexible device is manufactured, it needs to be peeled off from the rigid carrier substrate. In the prior art, the flexible device and the rigid carrier substrate are usually separated by laser irradiation. When performing laser irradiation and separation, the flexible device needs to be placed facing the base. In order to avoid direct contact between the flexible device and the base, the flexible device can be The device is covered with a protective film, the...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56
CPCH10K71/00
Inventor 王伟孙中元倪静凯罗程远
Owner BOE TECH GRP CO LTD
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