Semiconductor packaging member processing device
A processing device and semiconductor technology, applied in the fields of semiconductor devices, semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, etc., can solve problems such as process delay, difficulty in using automated devices, and reduced work efficiency, and achieve enhanced adhesion. Effect
Active Publication Date: 2017-06-30
HANMI SEMICON CO LTD
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Problems solved by technology
[0005] In the conventional semiconductor package processing equipment, in order to perform the sputtering process, it is difficult to uniformly attach the semiconductor package during the process of attaching the semiconductor package to the fixed film formed on the frame, which causes a delay in the process.
[0006] In addition, there are burrs (burr) formed by the sputtering evaporation material remaining around the edge where the bottom surface and the side surface of the sputtered semiconductor package are in contact. It is necessary to remove the burr by manual work, thus reducing the work efficiency. , and difficult to use automation
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[0042] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the embodiments described here, but can be embodied in other forms. On the contrary, the embodiments introduced here are used to complete the disclosure, and are also used to fully convey the idea of the present invention to those of ordinary skill in the technical field of the present invention. In the entire specification, the same reference numerals denote the same structural elements.
[0043] figure 1 It is a top view of an embodiment of the semiconductor package processing apparatus 1 of the present invention.
[0044] The semiconductor package processing apparatus 1 of the present invention includes: a frame supply and recovery unit 100 that supplies a frame (not shown) for performing a sputtering process with a plurality of semiconductor packages attached, and recovers and separates the semiconduct...
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The invention relates to a semiconductor packaging member processing device. A semiconductor packaging member after a sputtering process is separated from a frame having a fixing film, and the residual rags of the semiconductor packaging member are effectively removed by the sputtering process, and then the semiconductor packaging member is conveyed, or the semiconductor packaging member provided by a semiconductor packaging member supply part is picked up, and is stably attached to the frame having the fixing film used for the semiconductor packaging member sputtering process for fixing.
Description
Technical field [0001] The present invention relates to a semiconductor package processing apparatus. In more detail, the present invention relates to a semiconductor package after a sputtering process is separated from a frame with a fixed film, and the burr remaining on the semiconductor package is effectively removed by the sputtering process, and then the semiconductor is transported. A package or a semiconductor package processing device that picks up a semiconductor package supplied from a semiconductor package supply part and stably attaches it to a frame having a fixing film for a semiconductor package sputtering process and fixes it. Background technique [0002] The invention relates to a semiconductor package processing device. In order to block electromagnetic waves that affect the human body or minimize electronic interference between adjacent electronic products, semiconductor packages used in electronic products perform a sputtering process on individual semiconduc...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67121H01L23/528H01L24/26H01L21/67712
Inventor 林栽瑛
Owner HANMI SEMICON CO LTD