Bonding area ratio peeling test method for thermal insulation materials on the basis of image processing technology

Abstract

The invention discloses a bonding area ratio peeling test method for thermal insulation materials on the basis of an image processing technology. The test method includes the steps as follows: 1) peeling a thermal insulation board; 2) determining solid adhesion or false adhesion; 3) line drawing: drawing external frame lines of a thermal insulation material on a base wall body with a red marking pen, and then drawing an external bounding line of every area of bonding mortar, if the bonding mortar, peeled with the thermal insulation material, belongs to the solid adhesion part after determination, complementing the external bounding lines during the line drawing; and 4) photographing the base wall body at the sampled positions; and 5) image processing: calculating a first pixel, which is the area corresponding to interior of the external bounding lines, and a second pixel, which is the total area of the bonding mortar parts in the external bounding lines, through image processing software; and 6) calculating the ratio of area. The method can quickly and accurately calculate the area ratio of bonding area of the external wall thermal insulation material, and has excellent applicability and reliability.

Description

technical field [0001] The invention relates to the field of construction, in particular to a peeling test method for the bonded area ratio of thermal insulation materials based on image processing technology. Background technique [0002] As an important part of the wall energy-saving project, the insulation material has a direct impact on the energy-saving effect of the wall due to its construction quality and reliability. GB 50411-2007 "Code for Construction Quality Acceptance of Building Energy-saving Engineering" requires that the bonding or connection between the insulation material and the base layer and each structural layer must be firm, the bond strength should meet the design requirements, and the bond strength between the insulation board and the base layer should be On-site pull-out test. Afterwards, it is verified by engineering practice that only the on-site pull-out test is used to check whether the bond strength meets the standard at the position where the ...

AI Technical Summary

Problems solved by technology

[0004] In order to improve the accuracy, the small grids of graph paper are used to measure, and the irregular adhesive mortar is subdivided into grids, and then the area of ​​the adhesive mortar is counted by counting the small grid

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