Substrate stretching device, film forming device, and method for manufacturing film and organic electronic device

Abstract

The present invention provides a substrate stretching device, a film-forming device, and a method for manufacturing a film and an organic electronic device, which can exert a substrate stretching force corresponding to the slack of the substrate, hardly cause slack of the substrate, and enable good overlapping of the mask and the substrate , to achieve high-precision film formation. A substrate stretching device, which is provided with a pair of clamping mechanisms facing each other, wherein the clamping mechanism has a plurality of gripping parts that clamp the substrate from up and down, and a driving member is respectively provided for each of the gripping parts , the driving member transmits a pressing force for holding the substrate and a tensile force for pulling the substrate outward to the holding portion.

Description

technical field [0001] The present invention relates to a substrate stretching device that prevents loosening of a substrate by stretching the substrate. Background technique [0002] Since the weight of the substrate increases as the size of the substrate increases, when a large substrate is held horizontally, the substrate may bend downward due to the weight of the substrate, thereby causing slack in the substrate. For example, Patent Document 1 describes a device that prevents slack in a substrate by pulling opposite end portions of the substrate to each other. [0003] Patent Document 1: Korean Registered Patent No. 10-1456671 [0004] The substrate clamping mechanism described in Patent Document 1 is configured to use a plate to which a plurality of subdivided substrate supporting pieces are bonded, and to drive and pull the substrate to both sides via the plate. [0005] However, the degree of slack of the substrate varies depending on the material, shape, area, etc....

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Problems solved by technology

[0005] However, depending on the material, shape, area, etc. of the supported substrate, the degree of slack in the substrate varies.

In the various structures of Patent Document 1, depending on the substrates to be supported, the force for clamping the substrate between the support pieces is biased, or the substrate slips between the support pieces with weak clamping force, and the pulling When stretching the substrate, the tensile force of the substrate in the length direction of the substrate will be biased

Therefore, there is a concern that the slack of the substrate cannot be eliminated, or the slack of the substrate can be promoted conversely

[0006] If the slack of the substrate is large, not only will it not be possible to achieve uniform film formation, but it will also cause large variations in the film formation pattern when a thin film is formed on the substrate using a mask.

[0007] In addition, since it is a structure that stretches and drives the board with all the support pieces combined, if the clamping force is increased to eliminate slippage of the substrate at the support piece where the clamping force is weak, the clamping force may increase depending on the position. become too strong and cause substrate breakage

Moreover, since a driving device with a large stretching force is required, the energy consumption required for substrate stretching will increase or the stretching device will be enlarged.

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