Display device structure and manufacturing method thereof

A technology for display devices and display modules, which is applied in the manufacture of semiconductor/solid-state devices, electric solid-state devices, semiconductor devices, etc., and can solve the problems of increasing the difficulty of bonding, reducing the bending characteristics of the panel, and uneven small bubbles on the bonding surface. problems, to avoid device damage and improve performance

Inactive Publication Date: 2017-07-25
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] b) Similarly, when performing the above-mentioned lamination process, the stress generated during lamination will cause OLED peeling (Peeling), which in turn will cause the above-mentioned dark area defects on the display device;
[0006] c) During the above lamination process, if the fluidity of the lamination adhesive is not good, it will lead to uneven bonding surface or small air bubbles, which in turn will cause the above-mentioned halo defects on the display device
[0007] Similarly, after the flexible substrate laser release process, the stress generated when the above-mentioned protective film is pasted will cause the film quality of the buffer layer (buffer layer) on the upper layer of the flexible substrate to change, which in turn will lead to the electrical drift of the TFT in the display device. , which will affect the driving effect of the entire panel; and the above-mentioned press-fit stress will also cause defects in the water vapor intrusion channel in the flexible substrate, which will further i

Method used

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  • Display device structure and manufacturing method thereof
  • Display device structure and manufacturing method thereof
  • Display device structure and manufacturing method thereof

Examples

Experimental program
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Example Embodiment

[0075] Example one

[0076] figure 1 Is a schematic diagram of the structure of a traditional flexible display device, figure 2 This is a schematic diagram of the structure of the display device in the embodiment of this application; figure 1 As shown, the upper surface of the flexible base 12 of the conventional display device is prepared with a display module 13 (including a display substrate 131, an organic light-emitting layer 132 and a thin film encapsulation layer 133) and a polarizer 14, and the lower surface of the flexible substrate 12 is prepared There is a protective film 11; during the bonding process of device preparation, the effective area of ​​the panel (ie, the display module 13) of this structure is easily damaged due to the stress generated by the bonding process and other manufacturing processes.

[0077] In order to effectively avoid damage to the effective area of ​​the panel caused by the stress generated by the bonding process and other manufacturing proce...

Example Embodiment

[0090] Example two

[0091] Based on the first embodiment above, such as Figure 2~4 This embodiment also provides a method for manufacturing a display device, which can be applied to prepare a flexible display device, and the method includes:

[0092] First, a flexible substrate 23 having a front surface and a back surface opposite to the front surface is provided.

[0093] Next, a display substrate 241, an organic light emitting layer 242, and a thin film encapsulation layer 243 are sequentially prepared on the front surface of the flexible base 23 to form the display module 24 of the display device.

[0094] After that, continue the inkjet printing process, if the ink viscosity is less than 20cps and the surface tension is 20~35mN / m 2 , The spraying material is acrylate or silicone, etc. on the upper surface of the display module 24 (that is, the upper surface of the film encapsulation layer 243) and the back surface of the flexible substrate 23 are prepared with a thickness of 2~ ...

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Abstract

The invention relates to a display device structure and a manufacturing method thereof and relates to the technical field of a semiconductor. Buffer layers are arranged between a display module and a top film layer and between a flexible substrate and a protection film to buffer stress of the applying process on the display module, so damage to the device caused by the stress can be effectively avoided, and performance of the display device is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a display device structure and a display device manufacturing method. Background technique [0002] At present, in the manufacturing process of flexible display devices, due to the bending stress generated when the flexible display is bent, and the bonding process in the back-end process (BEOL) (such as a bonding process after film packaging, laser release The stress generated by the secondary bonding process after the process, etc.) will have an adverse effect on the performance of the flexible display device, and even lead to the failure of the device. [0003] For example, when carrying out the top protection film (1 st Lamination Protect Film) or polarizer (Polarizer) bonding process, the rollers used will produce dark spots, dark areas or Halo (Mura) and many other defects, specifically: [0004] a) During the above-mentioned lamination process, foreign particles ...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/52
CPCH10K59/12H10K50/84H10K59/1201
Inventor 陈一鸣黄添旺吴建霖
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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