Display device structure and manufacturing method thereof

Abstract

The invention relates to a display device structure and a manufacturing method thereof and relates to the technical field of a semiconductor. Buffer layers are arranged between a display module and a top film layer and between a flexible substrate and a protection film to buffer stress of the applying process on the display module, so damage to the device caused by the stress can be effectively avoided, and performance of the display device is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a display device structure and a display device manufacturing method. Background technique [0002] At present, in the manufacturing process of flexible display devices, due to the bending stress generated when the flexible display is bent, and the bonding process in the back-end process (BEOL) (such as a bonding process after film packaging, laser release The stress generated by the secondary bonding process after the process, etc.) will have an adverse effect on the performance of the flexible display device, and even lead to the failure of the device. [0003] For example, when carrying out the top protection film (1 st Lamination Protect Film) or polarizer (Polarizer) bonding process, the rollers used will produce dark spots, dark areas or Halo (Mura) and many other defects, specifically: [0004] a) During the above-mentioned lamination process, foreign particles ...

AI Technical Summary

Problems solved by technology

[0005] b) Similarly, when performing the above-mentioned lamination process, the stress generated during lamination will cause OLED peeling (Peeling), which in turn will cause the above-mentioned dark area defects on the display device;

[0006] c) During the above lamination process, if the fluidity of the lamination adhesive is not good, it will lead to uneven bonding surface or small air bubbles, which in turn will cause the above-mentioned halo defects on the display device

[0007] Similarly, after the flexible substrate laser release process, the stress generated when the above-mentioned protective film is pasted will cause the film quality of the buffer layer (buffer layer) on the upper layer of the flexible substrate to change, which in turn will lead to the electrical drift of the TFT in the display device. , which will affect the driving effect of the entire panel; and the above-mentioned press-fit stress will also cause defects in the water vapor intrusion channel in the flexible substrate, which will further increase the probability of the above-mentioned dark spot defects in the display device

[0008] In order to reduce the occurrence of the above-mentioned defects as much as possible, the current industry mainly uses a reinforcement layer on the protective film layer of the display device to prevent damage to the panel caused by stress during bending; The strengthening layer, and the stress generated by the lamination will still cause defects such as dark spots, dark areas, halos, etc. on the panel of the display device; in addition, there are currently certain requirements for the thickness of the strengthening layer, if the thickness of the strengthening layer is less than 25μm will increase the difficulty of bonding, and if the thickness of the reinforcement layer is greater than 300μm, the bending characteristics of the panel will be greatly reduced, so the thickness of the reinforcement layer should be limited between 25 and 300μm, which will greatly reduce the Limits panel options and their reduction in thickness

Images