Dividing device and wafer dividing method

Abstract

Provided are a dividing device and a method for dividing a wafer, which remove wrinkles from a tape with a simple device structure and appropriately maintain chip intervals. This wafer dividing method uses a dividing device that divides a wafer (W) supported by an annular frame (F) through a tape (T) into individual chips (C) at a dividing start point along a planned dividing line, The splitting method of this wafer has the following steps: a holding step, the ring frame is held on the ring frame holding part (20), and the wafer inside the ring frame is held on the holding table (10); the splitting step , the tape is stretched by holding the separation of the table and the ring-shaped frame holding part to split the wafer at the starting point of the split; and the chip separation process is to thermally shrink the stretched tape in the circumferential direction or radial direction according to the prescribed heating range The heater (51) heats the heating range between the outer periphery of the wafer and the inner periphery of the ring frame to separate the chips.

Description

technical field [0001] The present invention relates to a dividing device for dividing a wafer into individual chips along a planned dividing line and a method for dividing the wafer. Background technique [0002] In recent years, a method for increasing the number of chips to be obtained from one wafer by reducing the line width of the planned dividing line of the wafer has been known (for example, refer to Patent Document 1). In the method for dividing a wafer described in Patent Document 1, a modified layer along a line to be divided is formed inside the wafer by irradiating a laser beam which is transparent to the wafer. Thereafter, the tape attached to the ring frame is expanded by an expanding device or the like, whereby an external force is applied to the wafer attached to the upper surface of the tape, and the wafer is divided into individual chips starting from the modified layer. [0003] Although the gap between chips is enlarged by the stretching of the tape, wh...

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Problems solved by technology

[0007] However, since tension is applied in one direction of the tape when the tape is bonded to the ring frame, it is easy to place the tape opposite the wafer in the other direction perpendicular to the direction to which the tension is applied. become radially relaxed folds

In this case, in the method of Patent Document 2, since the tape between the outer periphery of the wafer and the inner periphery of the ring frame is uniformly heated, wrinkles cannot be sufficiently removed from the tape.

In the method of Patent Document 3, a structure for thermocompression-bonding the tape over the entire range in the circumferential direction is required, and the device structure becomes complicated.

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