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Liquid metal thermal interface material with self-melting properties

A technology of thermal interface material and liquid metal, which is applied in the direction of metal rolling, metal layered products, chemical instruments and methods, etc., can solve problems such as large increase in fluidity, liquid metal side leakage, circuit board short circuit, etc., and achieve processing The smelting method is simple, the production cost is low, and the heat dissipation performance is good.

Active Publication Date: 2019-02-26
NINGBO SYRNMA METAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This feature makes the fluidity of liquid metal as a thermal interface material increase greatly with the increase of temperature, and side leakage will occur when liquid metal is used as a thermal interface material, and the circuit board will be short-circuited due to the conductivity of liquid metal

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A liquid metal composite thermal interface material structure for heat dissipation at 80°C. In terms of weight percentage, the alloy composition of the intermediate layer is: Zn: 6.4%, Sb: 1.2%, Sn: 5.8%, Mo: 0.2%, V: 0.3%, and the balance is In. The alloy composition of the upper and lower layers is: Zn: 2.1%, Sb: 3.2%, Sn: 15.0%, W: 0.1%, V: 0.1%, and the balance is In. The alloy with the above composition was melted in a graphite crucible in an argon-protected vacuum induction melting furnace at 420° C., and homogenized by electromagnetic stirring for 10 minutes. The molten liquid metal is then cast into graphite molds. The liquid metal ingot was cold rolled with a reduction of 25% in each pass. The middle layer and upper and lower layers are rolled to thicknesses of 1mm and 0.06mm respectively. Composite rolling the upper and lower layers and the middle layer, the thickness before rolling is 1+0.06*2=1.12mm. The total thickness after rolling is 0.1mm. In this e...

Embodiment 2

[0020] A liquid metal composite thermal interface material structure for heat dissipation at 120°C. In terms of weight percentage, the alloy composition of the intermediate layer is: Zn: 7.9%, Sb: 1.7%, Sn: 5.9%, Mo: 0.4%, V: 0.2%, and the balance is In. The liquid metal composition of the upper and lower layers is Zn: 3.5%, Sb: 5.2%, Sn: 16.7%, W: 0.1%, V: 0.1%, and the balance is In. The alloy with the above composition was melted in a graphite crucible in an argon-protected vacuum induction melting furnace at 420° C., and homogenized by electromagnetic stirring for 10 minutes. The molten liquid metal is then cast into graphite molds. The liquid metal ingot was cold rolled with a reduction of 25% in each pass. The middle layer and upper and lower layers are rolled to thicknesses of 1mm and 0.06mm respectively. Composite rolling the upper and lower layers and the middle layer, the thickness before rolling is 1+0.06*2=1.12mm. The total thickness after rolling is 0.1mm. In...

Embodiment 3

[0022]A liquid metal composite thermal interface material structure for heat dissipation at 160°C. In terms of weight percentage, the alloy composition of the intermediate layer is: Zn: 9.5%, Sb: 1.7%, Sn: 5.4%, Mo: 0.6%, V: 0.3%, and the balance is In. The liquid metal composition of the upper and lower layers is Zn: 3.4%, Sb: 2.9%, Sn: 12.4%, W: 0.1%, V: 0.1%, and the balance is In. The alloy with the above composition was melted in a graphite crucible in an argon-protected vacuum induction melting furnace at 420° C., and homogenized by electromagnetic stirring for 10 minutes. The molten liquid metal is then cast into graphite molds. The liquid metal ingot was cold rolled with a reduction of 25% in each pass. The middle layer and upper and lower layers are rolled to thicknesses of 1mm and 0.06mm respectively. Composite rolling the upper and lower layers and the middle layer, the thickness before rolling is 1+0.06*2=1.12mm. The total thickness after rolling is 0.1 mm. In...

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Abstract

The invention discloses a liquid metal thermal interface material with a self-fluxing characteristic. The material is of a three-layered liquid metal structure. The middle layer is a liquid metal of large melting and is composed of the following components in percentage by weight: 6.0%-10.0% of Zn, 1.0%-2.0% of Sb, 5.0%-6.0% of Sn, 0.3%-0.8% of Mo, 0.2%-0.4% of V and the balance of In; the upper and lower layers are liquid metals with small hot smelting and are composed of the following components in percentage by weight: 1.0%-4.0% of Zn, 2.0%-6.0% of Sb, 10.0%-20.0% of Sn, 0.1%-0.2% of W, 0.1%-0.2% of V and the balance of In. The product can maintain a solid state in a normal working state of a thermal interface material while the high thermal conductivity (20-85W / m.K) of the liquid metal thermal interface material is maintained. As the temperature around the interface is raised, the upper and lower layers are melted, and therefore, microporous pores in the surfaces of a heating element and a heat-dissipating body are effectively filled. Under the circumstance of guaranteeing that liquid metal works in a solid state, side leakage is fundamentally avoided.

Description

technical field [0001] The invention relates to the field of liquid metal, in particular to a liquid metal thermal interface material with self-melting properties. Background technique [0002] As we all know, IGBT devices have become the mainstream devices in the development of power semiconductor devices today due to their high input resistance, fast switching speed, low on-state voltage, high blocking voltage, and large current. They are widely used in various AC motors, In the power electronic circuit of frequency converter, switching power supply, lighting circuit, traction drive and other fields. When the IGBT device is working, the heat generated will cause the chip temperature to rise rapidly beyond the maximum allowable IGBT junction temperature. Therefore, the performance of the IGBT will be greatly reduced, and cannot work stably, resulting in performance degradation or failure. Due to the further development of IGBT technology in recent years, the related high-...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/01C22C28/00B21B1/46
CPCB21B1/463B32B15/01B32B2307/302C22C28/00
Inventor 刘亚军曹贺全曹帅郭强吴智鑫
Owner NINGBO SYRNMA METAL MATERIALS CO LTD