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Substrate mounting table and substrate processing apparatus

A technology of substrate processing device and mounting table, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve the problems of large application of dielectric layers, cracking and peeling of dielectric layers, etc.

Inactive Publication Date: 2017-08-22
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Historically, aluminum has been mostly used as the substrate and alumina as the dielectric layer, but the linear expansion coefficient of aluminum is 23.8×10 -6 / °C, in contrast, the linear expansion coefficient of alumina is 6.4×10 -6 / °C, when the temperature of the substrate mounting table rises due to heat such as plasma, a large pressure is applied to the dielectric layer, and cracks and peeling may occur in the dielectric layer
In particular, such a problem becomes remarkable in a mounting table for a large FPD substrate

Method used

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  • Substrate mounting table and substrate processing apparatus
  • Substrate mounting table and substrate processing apparatus
  • Substrate mounting table and substrate processing apparatus

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Embodiment Construction

[0061] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, in all the drawings, common reference numerals are assigned to common parts.

[0062] figure 1 It is a cross-sectional view showing a plasma processing apparatus as a substrate processing apparatus using a substrate mounting table according to an embodiment of the present invention.

[0063] like figure 1 As shown, this plasma processing apparatus is configured as an inductively coupled plasma etching apparatus for etching a rectangular glass substrate (hereinafter referred to simply as “substrate”) G for FPD. Examples of the FPD include a liquid crystal display (LCD), an electroluminescence (Electro Luminescence; EL) display, a plasma display panel (PDP), and the like.

[0064] This plasma processing apparatus 100 has an airtight main body container 1 in the shape of an angular cylinder formed of a conductive material such as aluminum whose inner wall surface...

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Abstract

The invention provides a substrate mounting table with an electrostatic chuck. A dielectric layer formed of a ceramic sprayed film on the electrostatic chuck is hard to fracture and peel off even through at temperature exceeding 120 DEG C. A substrate mounting table (30) for mounting a substrate and operating at a temperature exceeding 120 DEG C in a substrate processing apparatus for processing a processed substrate in a processing container (4) comprises a metal substrate (31) and the electrostatic chuck (32) for adsorbing the processed substrate. The electrostatic chuck (32) has a dielectric layer (45) and an adsorbing electrode (46). The dielectric layer (45) is arranged on the substrate (31) and is formed by a ceramic sprayed film. The adsorbing electrode (46) is arranged in the dielectric layer (45). At least a portion of the substrate (31) in contact with the dielectric layer (45) is made of martensitic stainless steel or ferritic stainless steel.

Description

technical field [0001] The present invention relates to a substrate mounting table for mounting a substrate and a substrate processing apparatus using the same. Background technique [0002] In the manufacturing process of a flat panel display (FPD), etching, sputtering, CVD (Chemical Vapor Deposition), and the like are performed on the substrate to be processed. [0003] As a substrate processing apparatus that performs such processing, a substrate to be processed is mounted on a substrate mounting table arranged in a chamber (processing container), and plasma is generated in the chamber while the inside of the processing container is kept in a vacuum state. A device for performing plasma treatment on a substrate to be processed. [0004] As a substrate mounting table of such a substrate processing apparatus, a substrate mounting table having a base and an electrostatic chuck provided thereon is known. The electrostatic chuck includes a dielectric layer formed by ceramic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67011H01L21/6833H01L21/324H01L21/4807H01L21/67098H01L21/6831H01L21/6835
Inventor 佐佐木芳彦南雅人佐佐木和男
Owner TOKYO ELECTRON LTD