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Apparatus and method for regulating surface temperature of polishing pad

A technology of surface temperature and grinding pad, which is applied in the direction of grinding device, grinding/polishing safety device, grinding machine tool, etc., can solve the problems of surface temperature fluctuation of grinding pad 103, inability to obtain grinding speed, etc.

Active Publication Date: 2017-08-29
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Like this, in the conventional pad temperature adjusting device, there is following problem: in the polishing process of wafer, the surface temperature of polishing pad 103 fluctuates greatly, can't obtain desired polishing speed (also referred to as removal speed).

Method used

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  • Apparatus and method for regulating surface temperature of polishing pad
  • Apparatus and method for regulating surface temperature of polishing pad
  • Apparatus and method for regulating surface temperature of polishing pad

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Embodiment Construction

[0083] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0084] figure 1 is a schematic diagram showing a grinding device. Such as figure 1 As shown, the polishing apparatus is provided with: a top ring 1, which holds and rotates a wafer W as an example of a substrate; a polishing table 2, which supports a polishing pad 3; The surface of the pad 3 is supplied with a polishing liquid (such as slurry); and a pad temperature adjusting device 5 that adjusts the surface temperature of the polishing pad 3 . The surface (upper surface) of the polishing pad 3 constitutes a polishing surface for polishing the wafer W. As shown in FIG.

[0085] The top ring 1 can move in the vertical direction and can rotate in the direction indicated by the arrow around its axis. The wafer W is held on the lower surface of the top ring 1 by vacuum suction or the like. The grinding table 2 is connected to a motor (not shown), and is rotatable in...

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PUM

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Abstract

The invention provides an apparatus and method which is used for regulating a surface temperature of a polishing pad and can maintain the surface temperature of the polishing pad at a desired target temperature. The apparatus for regulating the surface temperature of the polishing pad, includes: a pad contact member which is contactable with a surface of the polishing pad and which has a heating flow passage and a cooling flow passage formed therein; a heating-liquid supply pipe coupled to the heating flow passage; a cooling-liquid supply pipe coupled to the cooling flow passage; a first flow control valve attached to the heating-liquid supply pipe; a second flow control valve attached to the cooling-liquid supply pipe; a pad-temperature measuring device configured to measure the surface temperature of the polishing pad; and a valve controller configured to operate the first flow control valve and the second flow control valve based on the surface temperature of the polishing pad.

Description

technical field [0001] The present invention relates to an apparatus and method for adjusting the surface temperature of a polishing pad used for polishing substrates such as wafers. Background technique [0002] A CMP (Chemical Mechanical Polishing) apparatus is used in the process of polishing the surface of a wafer in the manufacturing process of a semiconductor device. In the CMP apparatus, the wafer is rotated while being held by a top ring, and the surface of the wafer is polished by pressing the wafer against a polishing pad on a rotating polishing table. In the polishing process, a polishing liquid (slurry) is supplied to the polishing pad, and the surface of the wafer is planarized by the chemical action of the polishing liquid and the mechanical action of abrasive grains contained in the polishing liquid. [0003] The polishing speed of the wafer not only depends on the polishing load of the polishing pad on the wafer, but also depends on the surface temperature o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/005B24B37/10B24B37/20B24B37/30B24B37/34B24B55/03
CPCB24B37/005B24B37/107B24B37/20B24B37/30B24B37/34B24B55/03B24B37/015
Inventor 丸山徹松尾尚典本岛靖之江藤洋平小松三教
Owner EBARA CORP
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