Organic light-emitting diode display panel packaging structure, manufacturing method, and display device

Abstract

The invention discloses an organic light emitting diode display panel packaging structure, a manufacturing method thereof, and a display device, which relate to the field of display technology and are used for improving the sealing reliability of organic light emitting diode device packaging and prolonging the service life of the organic light emitting diode device. The packaging structure of the organic light emitting diode display panel includes an organic light emitting diode display substrate and a glass cover plate arranged oppositely, and a packaging part is provided between the non-display area of ​​the organic light emitting diode display substrate and the part of the glass cover plate corresponding to the non-display area, The encapsulation part includes: a first concave-convex structure arranged on the organic light emitting diode display substrate, a second concave-convex structure arranged on the glass cover plate, and an encapsulation material arranged between the first concave-convex structure and the second concave-convex structure. The packaging structure of the organic light emitting diode display panel provided by the invention, its manufacturing method, and the display device are used in the OLED display device.

Description

technical field [0001] The invention relates to the field of display technology, in particular to an organic light emitting diode display panel packaging structure, a manufacturing method thereof, and a display device. Background technique [0002] Organic Light Emitting Diode (OLED) devices are widely used in the display industry due to their advantages of high brightness, full viewing angle, fast response and flexible display. However, since the organic light emitting diode device is very sensitive to water and oxygen in the air, the water and oxygen that penetrate into the organic light emitting diode device will seriously affect the service life of the organic light emitting diode device. Therefore, the organic light emitting diode device needs to use The encapsulation structure is used for encapsulation, so as to block water, oxygen, etc. by using the encapsulation structure. [0003] At present, laser glass encapsulation (Frit encapsulation) is a commonly used encapsu...

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Problems solved by technology

[0004] However, the glass barrier is easily broken when subjected to external pressure, and, as the forming material of the glass barrier ages, the adhesion between the glass barrier and the organic light-emitting diode display substrate and the glass cover is also easily reduced, making the glass barrier Cracks appear where the wall overlaps the organic light emitting diode display substrate and glass cover, causing external water and oxygen to penetrate into the organic light emitting diode device, thereby reducing the service life of the organic light emitting diode device

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