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Resistor and method for manufacturing resistor

A manufacturing method and technology of resistors, applied in the direction of resistors, thick film resistors, resistor parts, etc., can solve the problems of solder cracks, peeling off of substrates and heat sinks, etc., to prevent peeling, excellent heat resistance, The effect of suppressing bending stress

Active Publication Date: 2019-04-12
MITSUBISHI MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] However, in the conventional bonding method, such as Patent Document 1, when the substrate and the heat sink are bonded by solder, if the bending is corrected by pressing in the subsequent process, solder cracks are likely to occur, and there is a possibility that the substrate and the heat sink are peeled off. worry

Method used

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  • Resistor and method for manufacturing resistor
  • Resistor and method for manufacturing resistor
  • Resistor and method for manufacturing resistor

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Experimental program
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Embodiment

[0153] Hereinafter, the results of confirmation experiments conducted to confirm the effects of the present invention will be described.

[0154] (Examples 1 to 5 of the present invention)

[0155] On one side of a ceramic substrate (15 mm x 11 mm x 0.635 mmt) made of AlN, a Ta-Si-based resistor element (10 mm x 10 mm x 0.5 μm) was formed by sputtering. Next, Cu films were formed on both ends of the resistance element by sputtering, and then Cu electrodes (2 mm×10 mm) with a thickness of 1.6 μm were formed by electroplating. Next, on the other side of the ceramic substrate, a heat sink (20mm×13mm×3mmt) made of Al alloy (A1050) is laminated through an Al-Si based brazing foil, and a welding pressure of 3kgf / cm is applied in the lamination direction. 2 , held at 645° C. for 30 minutes in a vacuum atmosphere, and joined the ceramic substrate and heat sink with Al—Si-based brazing filler metal. Then, by cold straightening, which is the straightening step shown in the first embod...

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Abstract

The resistor of the present invention includes: a chip resistance element including a resistance element formed on one surface of a ceramic substrate and a metal electrode; a metal terminal electrically connected to the metal electrode; and an Al electrode formed on the other surface side of the ceramic substrate. In the component, the ceramic substrate and the Al component are joined by Al-Si-based brazing filler metal, the metal electrode and the metal terminal are joined by solder, and in the Al component, the ceramic substrate side The degree of curvature of the opposing surface facing each other is in the range of -30 μm / 50 mm or more and 700 μm / 50 mm or less.

Description

technical field [0001] The present invention relates to a resistor and a method for manufacturing the resistor. The resistor includes: a chip resistor element having a resistor element formed on one side of a ceramic substrate and a metal electrode; a metal terminal joined to the metal electrode; and Al parts made of Al or Al alloys. [0002] This application claims priority based on Patent Application No. 2015-014405 for which it applied in Japan on January 28, 2015, and uses the content here. Background technique [0003] As an example of an electronic circuit component, a resistor including a resistance element formed on one surface of a ceramic substrate and a metal terminal joined to the resistance element is widely used. The resistor generates Joule heat according to the value of the applied current, so that the resistor dissipates heat. In order to efficiently diffuse the heat generated by the resistor, for example, a resistor provided with a heat sink (radiation fi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C1/084H01C1/142H01C17/02H01C17/28
CPCH01C1/084H01C17/02H01C17/28H01C1/028H01C1/012H01C1/144H01C7/003H01C17/006H01C1/142
Inventor 长瀬敏之驹崎雅人
Owner MITSUBISHI MATERIALS CORP