Unlock instant, AI-driven research and patent intelligence for your innovation.

Anisotropic conductive film and connection method

An anisotropy and connection method technology, applied in the direction of conductive connection, electrical component connection, printed circuit structural connection, etc., can solve the problem of insufficient long-term conductivity between connection terminals, and achieve the effect of long-term excellent conductivity

Active Publication Date: 2019-07-12
DEXERIALS CORP
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, in this proposed technology, although the insulation between adjacent terminals is excellent, the long-term conductivity between the connection terminals is not sufficient.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Anisotropic conductive film and connection method
  • Anisotropic conductive film and connection method
  • Anisotropic conductive film and connection method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0135]

[0136] >

[0137] 55 parts by mass of bisphenol F-type epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name: jER-4004P), 25 parts by mass of bifunctional acrylic monomer (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name: A-200), amino 20 parts by mass of formate acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name: U-2PPA) and 4 parts by mass of phosphate ester type acrylate (manufactured by Nippon Kayaku Co., Ltd., trade name: PM-2) were uniformly distributed by a conventional method. The mixture was mixed to prepare a composition for the first layer. The obtained composition was apply|coated on the peeling polyester film, and it dried with 70 degreeC hot air for 3 minutes, and the 1st layer with an average thickness of 5 micrometers was produced.

[0138] >

[0139] 45 parts by mass of phenoxy resin (manufactured by Nippon Steel Chemical Co., trade name: YP50), 20 parts by mass of bifunctional acrylic monomer (ma...

Embodiment 2

[0142] An anisotropic conductive film was produced in the same manner as in Example 1 except that the average thickness of the first layer was 3 μm and the average thickness of the second layer was 32 μm in Example 1.

Embodiment 3

[0144] An anisotropic conductive film was produced in the same manner as in Example 1 except that the composition of the first layer in Example 1 was changed to the composition shown in Table 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides an anisotropic conductive film that is excellent in insulation between adjacent terminals and long-term conductivity between connected terminals even when rust-proof-treated substrates are connected. The anisotropic conductive film has layers including a conductive particle-containing layer containing conductive particles, a thermosetting resin, and a curing agent, and a thermoplastic layer containing a phosphate ester compound.

Description

technical field [0001] The present invention relates to an anisotropic conductive film and a connection method. Background technique [0002] Conventionally, as a means of connecting electronic parts and substrates, a tape-shaped connecting material (for example, anisotropic conductive film (ACF: Anisotropic Conductive Film)) obtained by applying a thermosetting resin in which conductive particles are dispersed to a release film has been used. ). [0003] The anisotropic conductive film is used, for example, for the connection of COF (Chip on Film, chip-on-film packaging) and a rigid substrate (for example, PWB (Printed Wiring Board, printed circuit board)) (FOB: Flex on Board, soft and hard board bonding ). [0004] In order to improve the solderability of components such as IC chips and capacitors mounted on the above-mentioned rigid substrates, antirust treatment using an antirust agent called pre-flux (OSP: Organic Solderability Preservative) is sometimes performed . ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01B5/14H01B1/22H01R12/51H01R4/70C09J5/06C09J7/10C09J9/02C09J11/04C09J11/06C09J201/00H05K1/14H05K3/32
CPCC09J5/06C09J9/02C09J11/04C09J11/06C09J201/00H01R11/01H05K1/14H05K3/32C09J7/10C09J7/00
Inventor 大关裕树
Owner DEXERIALS CORP