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A high-toughness, high-strength, superconducting thermoelectronic potting compound and preparation method thereof

A high-strength, super-conductive technology, used in polymer adhesive additives, non-polymer adhesive additives, adhesives, etc., can solve the problems of low thermal conductivity, low mechanical strength, high cost, etc. The effect of high thermal conductivity, good fluidity and convenient operation

Active Publication Date: 2020-09-22
HUBEI GREENHOME MATERIALS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a high-toughness, high-strength, superconducting thermal electronic potting compound and its preparation method to solve the problem of poor toughness or good toughness of the existing electronic potting compound but low mechanical strength, low thermal conductivity or Technical problems such as high thermal conductivity but poor fluidity and high cost

Method used

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  • A high-toughness, high-strength, superconducting thermoelectronic potting compound and preparation method thereof

Examples

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Effect test

Embodiment 1

[0024] A high-toughness, high-strength, superconducting thermal electronic potting compound and a preparation method thereof, characterized in that it comprises the following process steps:

[0025] (1) Preparation of component A: First add 10 parts of epoxy resin 128 and 10 parts of side chain epoxy resin (ADK-Ep-4000) into a vacuum planetary mixer and stir for 10-15 minutes, then add active silica powder 6 Stir one part for 5-10 minutes, and finally slowly add 72 parts of thermally conductive filler and stir for 30-60 minutes. After the filler is evenly mixed, add 2 parts of toughening agent and stir for 5-10 minutes. The vacuum degree is 0.075-0.095 MPa, and the stirring speed is 500-800 rev / min, the final material is A component;

[0026] (2) The amine curing agent is a mixture of 5 parts of triethylenetetramine, 3 parts of polyetheramine D230, and 3 parts of 1,3-cyclohexanediamine;

[0027] (3) Mix component A and amine curing agent evenly in a weight ratio of 100:11, me...

Embodiment 2

[0029] A high-toughness, high-strength, superconducting thermal electronic potting compound and a preparation method thereof, characterized in that it comprises the following process steps:

[0030] (1) Preparation of component A: First add 10 parts of epoxy resin 128 and 5 parts of side chain epoxy resin (ADK-Ep-4000) into a vacuum planetary mixer and stir for 10-15 minutes, then add active silica powder 7 Stir each part for 5-10 minutes, and finally slowly add 75 parts of thermally conductive filler and stir for 30-60 minutes. After the filler is evenly mixed, add 3 parts of toughening agent and stir for 5-10 minutes. The vacuum degree is 0.075-0.095 MPa, and the stirring speed is 500-800 rev / min, the final material is A component;

[0031] (2) The amine curing agent is a mixture of 3 parts of tetraethylenepentamine and 5 parts of polyetheramine T403;

[0032] (3) Mix component A and amine curing agent evenly in a weight ratio of 100:8, measure the viscosity of the mixture ...

Embodiment 3

[0034] A high-toughness, high-strength, superconducting thermal electronic potting compound and a preparation method thereof, characterized in that it comprises the following process steps:

[0035] (1) Preparation of component A: First add 9 parts of epoxy resin 128 and 3 parts of side chain epoxy resin (ADK-Ep-4000) into a vacuum planetary mixer and stir for 10-15 minutes, then add active silica powder 8 Stir each part for 5-10 minutes, and finally slowly add 76 parts of thermally conductive filler and stir for 30-60 minutes. After the filler is evenly mixed, add 4 parts of toughening agent and stir for 5-10 minutes. The vacuum degree is 0.075-0.095 MPa, and the stirring speed is 500-800 rev / min, the final material is A component;

[0036] (2) The amine curing agent is a mixture of 3 parts of diethylenetriamine and 4 parts of isophorone diamine;

[0037] (3) Mix component A and amine curing agent evenly in a weight ratio of 100:7, measure the viscosity of the mixture immedi...

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Abstract

The present invention is a kind of high toughness, high strength, superconducting thermal electronic potting glue and its preparation method, which makes the present invention improve the toughness, tensile strength and shear strength of electronic potting glue compared with the prior art; active silicon The addition of micropowder and thermally conductive fillers makes the electronic potting adhesive have good fluidity and easy operation, but at the same time, the filling rate of thermally conductive fillers is high, which in turn makes the cured product have high thermal conductivity and can work for a long time in high temperature environments; and the thermally conductive fillers used It is α-alumina (needle) with high thermal conductivity and cheap price, which improves the current situation of low addition amount of α-alumina (needle) and limited thermal conductivity, and greatly reduces the cost.

Description

technical field [0001] The invention relates to the technical field of electronic potting glue, in particular to a high-toughness, high-strength, superconducting thermal electronic potting glue and a preparation method thereof. Background technique [0002] Epoxy resin electronic potting glue is widely used because of its relatively cheap price, convenient operation, and stable properties of cured products. However, due to its inherent defects, epoxy resin electronic potting adhesives tend to become brittle, harden, or even break after long-term use. The traditional method is to simply add a toughening agent to it, which will reduce the curing while toughening. The mechanical strength of the object cannot meet the application requirements. [0003] At the same time, with the rapid development of the electronics industry, electronic components and logic circuits are developing towards multi-function and integration, but the volume is developing towards miniaturization, which...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J11/08C09J11/04C08G59/50
CPCC08G59/5006C08G59/5026C08G59/504C08G59/5073C08L2203/206C08L2205/025C08L2205/03C09J11/04C09J11/08C09J163/00C08L63/00C08L9/06C08K3/36C08K7/08C08L9/00
Inventor 刘芳芳杨华肖华青黄圣
Owner HUBEI GREENHOME MATERIALS TECH INC