Ceramic component and manufacturing method thereof and electronic equipment thereof

A manufacturing method and ceramic technology, which are applied to manufacturing tools, ceramic molding machines, die-casting molds, etc., can solve the problems of insufficient bonding force of molding structural parts, and achieve the effects of simplifying the processing process, improving the processing accuracy, and enhancing the structural strength.

Inactive Publication Date: 2017-09-05
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The present disclosure provides a ceramic component, its manufacturing method, and electronic equipment, so as...

Method used

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  • Ceramic component and manufacturing method thereof and electronic equipment thereof
  • Ceramic component and manufacturing method thereof and electronic equipment thereof
  • Ceramic component and manufacturing method thereof and electronic equipment thereof

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Embodiment Construction

[0034] The exemplary embodiments will be described in detail here, and examples thereof are shown in the accompanying drawings. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present disclosure. Rather, they are only examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0035] The terms used in this application are only for the purpose of describing specific embodiments, and are not intended to limit the application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term ...

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Abstract

The disclosure relates to a ceramic component and a manufacturing method thereof and electronic equipment thereof. The manufacturing method of the ceramic component comprises the steps that surface treatment is conducted on a ceramic body in the forming process of the ceramic body, so that a plurality of holes are formed in the surface after the ceramic body is sintered and formed; a to-be-formed area used for forming a structural component is arranged on the sintered and formed ceramic body; the ceramic body is placed into an injection mould, a mould cavity corresponding to the structure of the structural component is formed in the injection mould, and the position of the to-be-formed area corresponds to the position of the mould cavity; and injection materials are injected into the injection mould, the structural component combined with the surface of the ceramic body is injected and formed in the mould cavity, and the ceramic component formed by combination of the structural component and the ceramic body is obtained. According to the technical scheme of the ceramic component and the manufacturing method thereof and the electronic equipment thereof, the machining technology of the ceramic component can be simplified, the production efficiency is accelerated, the machining precision is improved, and the combination strength of the ceramic body of the ceramic component and promotion of the structural component is facilitated.

Description

Technical field [0001] The present disclosure relates to the field of terminal technology, and in particular to a ceramic component, a manufacturing method thereof, and electronic equipment. Background technique [0002] Ceramic materials have a smooth surface and excellent grip feel, and have excellent hardness and wear resistance, so they are increasingly used in the structure and components of electronic devices such as mobile phones and tablets. [0003] The ceramic molding process in the related art can only be made with a simple and large plane structure, and it cannot be directly implemented on the ceramic molding die for buckles or other complicated structural parts. After referring to the processing process of metal materials such as aluminum alloy and stainless steel, that is, after sintering the ceramic parts, the structure is formed by mechanical processing or CNC (Numerical Control Machine Tool), and then the subsequent dispensing, adhesive, welding and other processes...

Claims

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Application Information

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IPC IPC(8): B28B1/26
CPCB28B1/262
Inventor 王建宇
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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