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A metal component implanted into electronic components using metal additive manufacturing technology and its preparation method

A technology of electronic components and manufacturing technology, applied in the field of metal parts and their preparation, which can solve problems such as damage to sensors

Active Publication Date: 2018-09-28
HONG KONG PRODUCTIVITY COUNCIL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It is not feasible to apply the traditional electronic component embedding method in the process of metal additive processing, because the metal powder will directly fuse and sinter on the electronic component and damage the sensor

Method used

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  • A metal component implanted into electronic components using metal additive manufacturing technology and its preparation method

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the examples given are not intended to limit the present invention.

[0021] The main purpose of the present invention is to provide a metal component implanted into electronic components using metal additive manufacturing technology and its preparation method. The key point is to avoid the direct transmission of high temperature during metal powder fusion and sintering to electronic components. This preparation method comprises the following steps:

[0022] Step 1: Applying metal additive manufacturing technology to build the lower part, the structure of the lower part includes a cavity for implanting electronic components. The shape of the lumen cooperates with the implanted electronic components to prevent the electronic components from creating ...

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Abstract

The present invention provides a metal component and its preparation method for implanting electronic components using metal additive manufacturing technology. Implant the inner cavity of the electronic component; step 2: implant the pre-prepared electronic component, and place a layer of temperature insulator on the implanted electronic component; step 3: set the cover on the temperature insulator, completely cover the lower layer The temperature insulator; Step 4: On the basis of the structure of the cover and the established lower part, continue to use metal additive manufacturing technology to build the remaining upper parts. The invention can prevent the embedded electronic components from being damaged due to the high temperature generated by the metal additive manufacturing technology, and can realize the function of customizing metal parts.

Description

technical field [0001] The invention relates to a metal part implanted into an electronic component by applying metal additive manufacturing technology and a preparation method thereof. Background technique [0002] There are many high-end systems that require sensors for process control and optimization, condition monitoring of key components, system maintenance and life management. In some cases, sensors need to operate in harsh environments such as high temperature, high pressure and corrosiveness. Sensors are generally connected and installed on manufactured components, and sensor installation must be expensive and complicated packaging. Insufficient protection of the sensor will shorten its life and reduce its reliability, which will eventually lead to a large difference between the data measured by the sensor and the actual situation. Research to simplify sensor installation, packaging, and enhance system stability and reliability is ongoing in industry and academia....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F3/105
CPCB22F10/00B22F10/20Y02P10/25
Inventor 李国强单铭贤陈伟伦
Owner HONG KONG PRODUCTIVITY COUNCIL
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