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Chip packaging structure

A technology of chip packaging structure and adhesive glue, which is applied in the electronic field, can solve the problems of enterprise and personal property loss, system disorder, user personal information theft, etc., and achieve the effect of ensuring work stability, use safety and improving reliability

Inactive Publication Date: 2017-09-22
GD MIDEA AIR-CONDITIONING EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the chip is subjected to the above-mentioned hazards, the system controlled by the chip will be disordered and shut down. In severe cases, the personal information of the user will be stolen, and the system controlled by the chip will be manipulated by illegal elements, which will cause serious property damage to enterprises and individuals. loss

Method used

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  • Chip packaging structure
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Embodiment Construction

[0028] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0029] In describing the present invention, it should be understood that the terms "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner ", "outside" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific Orientation, constru...

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Abstract

The invention discloses a chip packaging structure comprises a base plate, a wafer, a protection device and a plastic shell, wherein the wafer is fixed on the surface of the base plate, the protection device is covered on the wafer, the protection device comprises a protection cover and an insulating isolation piece, the protection cover is arranged on the base plate and at least one part of the protection cover is positioned on one side of the wafer far away from the base plate, the insulating isolation piece is filled between the protection cover and the wafer, and the plastic shell is arranged on the base plate and covered on the protection device. According to the chip packaging structure provided by the embodiment of the invention, the protection cover is arranged on the wafer so as to be able to playing a role in protecting the circuit structure on the surface of the wafer, and thus reliability of the chip packaging structure is enhanced, and work stability and use safety of the control system of the chip packaging structure are improved.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a chip packaging structure. Background technique [0002] With the rapid development of society, semiconductor chips, as the core devices of electronic technology, have been widely used in many industries, and have greatly promoted the development of social productivity. However, with the wide application of semiconductor chips, people's requirements for the use of semiconductor chips are also constantly increasing, so various types of semiconductor chips such as high-performance processors, MCUs, wifi chips, and memory chips have emerged. Because semiconductor chips are mostly used to store and transmit some important information, their operational reliability and safety have become the focus of increasing attention of users. [0003] At present, electromagnetic interference and human intrusion have seriously affected the normal operation of semiconductor chips. Among them...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L23/552
CPCH01L23/552H01L23/3107H01L23/3121H01L2224/8592H01L2924/15311H01L2924/16152H01L2924/19107H01L2924/3025H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73265H01L2924/00014H01L2924/00
Inventor 毕晓猛冯宇翔
Owner GD MIDEA AIR-CONDITIONING EQUIP CO LTD
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