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Connector and manufacturing method thereof

A manufacturing method and connector technology are applied in the direction of connection, connection device components, and contact assembly/disassembly, etc., which can solve the problems of complex assembly process and high production cost, improve production efficiency, save assembly production cost, Avoid contact with unstable effects

Inactive Publication Date: 2017-09-22
SHENZHEN LINKCONN ELECTRONICS
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  • Abstract
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  • Claims
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Problems solved by technology

This design structure is suitable for conventional earphone jacks, which are assembled vertically from top to bottom. However, it is difficult to apply to earphone jacks that require miniaturization and waterproof functions. Usually, a split structure is used to realize it, but it is divided into two parts. The body structure has the risk of non-contact when in contact, and the assembly process is complicated and the production cost is high

Method used

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  • Connector and manufacturing method thereof
  • Connector and manufacturing method thereof
  • Connector and manufacturing method thereof

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Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element at the same time. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0028] It should also be noted that the orientation terms such as left, right, up, and down in the embodiments of the present invention are only relative concepts or refer to the normal use state of the product, and should ...

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Abstract

The invention is applicable to the technical field of connectors, and discloses a connector and a manufacturing method thereof. The connector comprises a plastic seat body and a connection terminal. The connection terminal comprises a first terminal which is inlaid and injection-molded in the plastic seat body, and then a material tape is broken off. The first terminal comprises first and second side wall parts, a contact part and a connection part. First and second side wall parts are oppositely arranged at intervals. The contact part is integrally formed on one end of the first side wall part. The connection part is integrally connected with the other end of the first side wall part and the second side wall part. The upper end of the first side wall part stretches out of the back of the plastic seat body. The front end of the contact part stretches out of the front end of the plastic seat body. A plastic part integrally molded in the plastic seat body is filled between first and second side wall parts. The manufacturing method is used to manufacture the connector. According to the connector and the manufacturing method thereof, at least one terminal is inlaid and injection-molded, and then the material tape is broken off; and the connector has the advantages of stable and reliable structure and low production cost.

Description

technical field [0001] The invention belongs to the technical field of connectors, in particular to a connector and a manufacturing method thereof. Background technique [0002] At present, the terminals on the earphone jacks used in digital devices such as mobile phones in the market adopt an integrated structure: the contact end with the male head and the welding plate end are a one-time stamping and forming structure. This design structure is suitable for conventional earphone jacks, which are assembled vertically from top to bottom. However, it is difficult to apply to earphone jacks that require miniaturization and waterproof functions. Usually, a split structure is used to realize it, but it is divided into two parts. There is a risk of non-contact when the body structure is in contact, and the assembly process is complicated and the production cost is high. Contents of the invention [0003] The object of the present invention is to overcome the disadvantages of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R13/46H01R13/502H01R43/20
CPCH01R13/46H01R13/502H01R43/20
Inventor 杨敏王宪明
Owner SHENZHEN LINKCONN ELECTRONICS
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