Silicone composition

A composition, liquid silicon technology, applied in conductive materials dispersed in non-conductive inorganic materials, materials for heat exchange, conductive coatings, etc., to achieve the effect of inhibiting viscosity rise and inhibiting sedimentation

Active Publication Date: 2017-09-26
SEKISUI POLYMATECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] Therefore, according to these conventional techniques, when it is desired to prevent the sedimentation of the thermally conductive filler, the viscosity of the composition increases accordingly, and there is a problem that it cannot be used in applications where the increase in viscosity is not desired, such as thermally conductive greases.

Method used

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  • Silicone composition
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Comparison scheme
Effect test

no. 1 approach

[0045] In this embodiment, a mode in which a thermally conductive filler that imparts thermal conductivity is used as a non-dissolvable function-imparting filler will be described. As far as the thermally conductive silicon composition containing thermally conductive fillers is concerned in liquid silicon, after being arranged between a plurality of heating elements mounted on a substrate and a radiator disposed opposite to the heating element, it can be used as a function of distributing the heating elements. The dissipated heat is transferred to the material that acts as a heat sink.

[0046] The thermally conductive silicon composition contains liquid silicon, a thermally conductive filler (non-dissolvable function-imparting filler), and a non-liquid thickening suppressing anti-sedimentation material.

[0047] Liquid silicon includes both non-curable liquid silicon and curable liquid silicon. When non-curable liquid silicon is used, the thermally conductive silicon compositi...

no. 2 approach

[0076] In this embodiment, a mode in which a conductive filler that imparts conductivity is used as an insoluble function-imparting filler will be described. A conductive silicon composition containing a conductive filler in liquid silicon can be used as a conductive paste or the like.

[0077] Components, ratios, and the like other than the non-solubilizing function-imparting filler are the same as those of the silicon composition described in the first embodiment.

[0078] As fillers that can be used as non-solubilizing function-imparting fillers, any one or more selected from metals, metal oxides, and carbon compounds can be cited. These fillers may be the same fillers as those used in the above-mentioned embodiment as long as they have conductivity.

[0079] It is also preferable to contain the conductive filler in the range of 300 to 2500 parts by weight with respect to 100 parts by weight of liquid silicon. This is because the effect of the filler is not remarkable whe...

no. 3 approach

[0081] In the present embodiment, an embodiment in which a strength-imparting filler is used as an insoluble function-imparting filler will be described. A silicon composition containing a strength-imparting filler in liquid silicon can be used as a sealing material or the like for filling voids in buildings or the like.

[0082]Examples of the insoluble function-imparting filler used for the purpose of imparting strength include various fillers such as calcium carbonate and silica in addition to the thermally conductive fillers and electrically conductive fillers described in the above embodiments. Components, ratios, and the like other than the non-solubilizing function-imparting filler are the same as those of the silicon composition described in the first embodiment.

[0083] Variation

[0084] As the insoluble function-imparting filler contained in each of the above-mentioned embodiments, the filler (A) having an average particle diameter of 50 μm or less and the thermal...

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Abstract

The present invention provides a silicone composition that suppresses the precipitation of an insoluble function-imparting filling material and suppresses an increase in viscosity. Provided is a silicone composition that includes liquid silicone, an insoluble function-imparting filling material such as a thermally conductive filling material or an electrically conductive filling material, and a thickening-inhibiting precipitation prevention material or non-thickening precipitation prevention material such as a non-liquid cellulose compound or a polysaccharide. In a system that includes liquid silicone and an insoluble function-imparting filling material, the polysaccharide functions not as a thickening agent but as a thickening-inhibiting precipitation prevention material or a non-thickening precipitation prevention material, making it possible to obtain a silicone composition having low viscosity and being filled with a large quantity of a filling material.

Description

technical field [0001] The invention relates to a silicon composition which uses liquid silicon as a base material and has properties such as thermal conductivity. In particular, the present invention relates to a silicon composition disposed between a heating element and a heat radiating element and used as a thermally conductive grease having both thermal conductivity and storage stability. Background technique [0002] Electronic equipment such as computers and automobile parts dissipate heat generated by heating elements such as semiconductor elements and mechanical parts, so radiators and other radiators are used. Coated with thermally conductive grease. [0003] Since the thermal conductivity of this thermally conductive grease is lower than that of a heating element or radiator (typically made of metal), it is advantageous to be thinner. In addition, in order to avoid the air layer with extremely low thermal conductivity from infiltrating between the heating element...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08K3/22C08K3/36C08L1/02C08L3/02C08L93/00
CPCC08K3/22C08K3/36C08L1/02C08L3/02C08G77/20C08L5/00C08K3/04C08K3/08C08K5/053C08K5/07C08L83/04C09K5/14H01B1/20C09D5/24C08K2003/2227C08K2201/001
Inventor 渡部泰佳北田学
Owner SEKISUI POLYMATECH CO LTD
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