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Polyimide precursor composition, preparation method of polyimide and polyimide

A technology of polyimide precursor and compound composition, which is applied in the direction of coating, etc., can solve the problems of high time consumption, low mechanical properties of polyimide film, and excessive increase of preparation cost, etc., to achieve easy processing and suppress viscosity rising effect

Inactive Publication Date: 2017-11-21
TAIFLEX SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the molecular weight of the polyamic acid is reduced, the mechanical properties of the prepared polyimide film are also reduced, which cannot meet the needs of the application.
[0005] In addition, in the above-mentioned reaction, in order to obtain the appropriate coating viscosity, it needs to obtain the appropriate parameter conditions through complicated experiments, which takes a lot of time and cost, and increases the production cost
Furthermore, the prepared polyamic acid still cannot balance coating and mechanical properties

Method used

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  • Polyimide precursor composition, preparation method of polyimide and polyimide
  • Polyimide precursor composition, preparation method of polyimide and polyimide
  • Polyimide precursor composition, preparation method of polyimide and polyimide

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0087] In a 1000 ml four-port reactor with nitrogen, add 19.630 g (0.182 mol) of p-phenylenediamine, 2.639 g (0.0075 mol) of 9,9'-bis(4-aminophenyl)fluorene and 425 gram of N-methyl-2-pyrrolidone, and mixed uniformly at 20°C to 30°C to form a diamine compound solution.

[0088] Then, 7.434 g (0.034 mol) of pyromellitic dianhydride was added to the diamine compound solution to perform a preliminary reaction to form a reacted solution. Next, divide 44.565 grams (0.151 moles) of 3,3',4,4'-diphenyltetracarboxylic dianhydride into three equal parts, and add it to the aforementioned solution by adding in batches , and keep stirring to carry out the reaction.

[0089] After 4 hours, the polyamic acid of Synthesis Example 1 was obtained.

Synthetic example 2

[0091] In a 1000 ml four-port reactor with nitrogen gas, 26.112 grams (0.242 moles) of p-phenylenediamine, 3.511 grams (0.01 moles) of 9,9'-bis(4-aminophenyl)fluorene and 400 gram of N-methyl-2-pyrrolidone, and mixed uniformly at 20°C to 30°C to form a diamine compound solution.

[0092] Then, 9.888 g (0.045 mol) of pyromellitic dianhydride was added to this diamine compound solution to perform a preliminary reaction to form a reacted solution. Next, divide 58.54 grams (0.199 moles) of 3,3',4,4'-diphenyltetracarboxylic dianhydride into three equal parts, and add it to the aforementioned solution by adding in batches , and keep stirring to carry out the reaction.

[0093] After 4 hours, the polyamic acid of Synthesis Example 2 was obtained.

Synthetic example 3

[0095] In a 1000 ml four-port reactor with nitrogen gas, add 32.491 g (0.3 mol) of p-phenylenediamine, 4.368 g (0.013 mol) of 9,9'-bis(4-aminophenyl)fluorene and 375 gram of N-methyl-2-pyrrolidone, and mixed uniformly at 20°C to 30°C to form a diamine compound solution.

[0096] Then, 12.304 g (0.056 mol) of pyromellitic dianhydride was added to this diamine compound solution to perform a preliminary reaction to form a reacted solution. Next, divide 70.995 grams (0.241 moles) of 3,3',4,4'-diphenyltetracarboxylic dianhydride into three equal parts, and add it to the aforementioned solution by adding in batches , and keep stirring to carry out the reaction.

[0097] After 4 hours, the polyamic acid of Synthesis Example 3 was obtained.

[0098] Preparation of polyimide precursor composition

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Abstract

The present invention relates to a polyimide precursor composition, a method for preparing a polyimide, and polyimide. The polyimide precursor composition contains polyamic acid and a monomeric compound. The polyamic acid is prepared from a monomer mixture by a first reaction, wherein the monomer mixture comprises a diamine compound and a dianhydride compound. The aforementioned monomeric compound has two carboxyl groups and two ester groups. The prepared polyimide precursor composition can be further reacted to obtain a polyimide having good mechanical properties and film properties.

Description

technical field [0001] The present invention relates to a polyimide precursor composition and its application, in particular to provide a polyimide precursor composition capable of preparing polyimide with good mechanical properties and film properties. Background technique [0002] Polyimide has the advantages of thermal oxidation resistance, heat resistance, radiation resistance and chemical resistance, so polyimide is often used in automotive materials, aerospace materials, insulating materials and liquid crystal alignment films and other applications. Polyimide is generally prepared by performing a cyclization reaction (ie imidization reaction) on polyamic acid. Among them, the polyamic acid is formed by reacting a dianhydride compound and a diamine compound. [0003] However, based on the total amount of diamine compound used as 100 mole percent, when the total amount of dianhydride compound used is not less than 98 mole percent, the formed polyamic acid chain segment ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10
CPCC08G73/1007C08G73/1042C08G73/1067C09D179/08
Inventor 黄庆弘薛光廷陈秋风林圣钦
Owner TAIFLEX SCI
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