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Rapid heat dissipation type LED packaging base

An LED packaging and heat dissipation technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of insufficient heat dissipation effect of LED packaging base and shortened service life of LED chips, etc., to achieve simple structure, increase service life, The effect of low manufacturing cost

Inactive Publication Date: 2017-10-10
李超
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Problems solved by technology

[0002] Nowadays, with the continuous development of science and technology, the application range of LED packaging is constantly expanding, and the requirements for LED packaging are also higher. With the high output of LED chips, the light and heat emitted by LED chips continue to increase, but , the heat dissipation effect of the current LED package base is not increased, so that the service life of the LED chip is shortened

Method used

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  • Rapid heat dissipation type LED packaging base

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Embodiment Construction

[0013] All the features disclosed in this specification, or all disclosed methods or steps in the process, except for mutually exclusive features and / or steps, can be combined in any manner.

[0014] Any feature disclosed in this specification (including any appended claims, abstract and drawings), unless specifically stated, can be replaced by other equivalent or equivalent alternative features. That is, unless otherwise stated, each feature is just one example of a series of equivalent or similar features.

[0015] Such as figure 1 As shown, a fast heat dissipation type LED package base of the present invention includes a base 4 and an LED chip 9. The upper end of the base 4 is provided with an arc-shaped slot 12, and the arc-shaped slot 12 is provided with an LED mounting slot 10 in the middle. The LED installation groove 10 is arranged in an arc structure, a heat dissipation layer (not shown) is laid on the inner wall of the LED installation groove 10, and the arc groove 12 is...

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Abstract

The invention discloses a rapid heat dissipation type LED packaging base, comprising a base and an LED chip. An arc slot is arranged at the upper end of the base. An LED mounting slot is arranged in the middle of the arc slot. The LED mounting slot is arranged according to an arc structure. A heat dissipation layer is laid on the inner wall of the LED mounting slot. More than one vertical heat dissipation hole is arranged in the arc slot at two sides of the LED mounting slot. The upper and lower ends of the vertical heat dissipation holes are communicated. A fixing ring is fixedly mounted at the upper end of the LED mounting slot around the LED mounting slot. A reflection ring is fixedly mounted at the upper end of the fixing ring. A gap is formed between the reflection ring and the arc slot. The rapid heat dissipation type LED packaging substrate is simple in structure, reasonable in use, low in economic cost and wide in application range. Heat generated by the LED chip is absorbed in a water flow mode and the service life of the LED chip is greatly increased.

Description

Technical field [0001] The invention relates to a fast heat dissipation type LED packaging base. Background technique [0002] Nowadays, with the continuous development of technology, the scope of LED packaging applications is continuously expanding, and the requirements for LED packaging are also higher. With the high output of LED chips, the light and heat emitted by LED chips are increasing. , The current LED package base has no heat dissipation effect, which shortens the life of the LED chip. Summary of the invention [0003] The technical problem to be solved by the present invention is to provide a fast heat-dissipating LED packaging base with simple structure and capable of effectively dissipating the heat emitted by the LED chip. [0004] The present invention is realized through the following technical solutions: a fast heat dissipation type LED packaging base, comprising a base and an LED chip, an arc-shaped groove is provided on the upper end of the base, and an LED moun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64H01L33/48
CPCH01L33/641H01L33/486H01L33/642
Inventor 李超
Owner 李超
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