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Electronic device package including dielectric layer and encapsulant

A technology of electronic devices and dielectric layers, which is applied in the field of electronic device packages and can solve problems such as low energy loss

Active Publication Date: 2020-06-16
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of wind energy, the turbines generate AC power, but for transmission, DC power with lower energy losses is required

Method used

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  • Electronic device package including dielectric layer and encapsulant
  • Electronic device package including dielectric layer and encapsulant
  • Electronic device package including dielectric layer and encapsulant

Examples

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Embodiment Construction

[0017] Aspects and examples are now described with reference to the drawings, wherein like reference numerals are generally used to refer to like elements. In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more aspects of the examples. It will be apparent, however, to one skilled in the art that one or more aspects of the examples may be practiced with a lesser degree of specific detail. In other instances, known structures and elements are shown in schematic form in order to facilitate describing one or more aspects of the examples. It is to be understood that other examples may be utilized and structural or logical changes may be made without departing from the scope of the present disclosure. It should also be noted that the drawings are not or are not necessarily to scale.

[0018] In the following detailed description, reference is made to the accompanying drawings wh...

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PUM

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Abstract

A method comprising providing a carrier, arranging at least one semiconductor chip on the carrier, the semiconductor chip comprising at least one contact pad on a main face of the semiconductor chip remote from the carrier, applying contact elements to the contact pads, An electrical layer is applied on the carrier, semiconductor chip and contact elements, and an encapsulant is applied on the dielectric layer.

Description

technical field [0001] The present disclosure generally relates to a method for manufacturing an electronic device package, an electronic device package, and an electronic voltage converter module. In particular, the present disclosure relates to an electronic device package, such as a high power module, that includes a dielectric layer and an encapsulant that work together to improve performance and reliability. Background technique [0002] In many technical fields, voltage or current converters such as DC / DC converters, AC / DC converters, DC / AC converters or step-down converters are used. For example, for future energy supply, smart grids connect decentralized renewable energy sources. In the case of wind energy, the turbines generate AC power, but for transmission, DC power with lower energy losses is required. Thus, a smart grid essentially consists of HVDC transmission units with corresponding converter stations, in which tens of thousands of high power modules are re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56H01L25/07H01L23/538H01L23/49H01L23/29H01L23/31
CPCH01L21/561H01L23/29H01L23/31H01L23/49H01L23/538H01L25/072H01L2924/181H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/73265H01L2224/8592H01L2924/00014H01L2224/83951H01L24/03H01L24/48H01L24/73H01L24/85H01L2224/03462H01L2224/05647H01L2224/48491H01L2924/1815H01L2924/18301H01L23/3121H01L21/568H05K3/284H05K2203/1316H05K2203/1322H01L2924/13055H01L23/3142H01L23/3135H05K3/282H05K2201/09872H01L24/05H01L2924/13091H01L2924/00012H01L2224/45099H01L2924/00H01L23/552H01L24/06H01L23/562H05K2203/1377H01L21/563H01L21/52H01L21/565H01L23/295
Inventor E·富尔古特H·德普克O·霍尔菲尔德M·朱尔斯
Owner INFINEON TECH AG
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