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Integrated circuit package

A technology of integrated circuits and conductive pillars, applied in the field of integrated circuit packaging, can solve the problems of undesired, increased size, increased manufacturing and packaging complexity and cost, etc.

Inactive Publication Date: 2017-10-20
QUALCOMM TECH INT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is known that providing EMI shielding to integrated circuit packages may increase the size of the package to an undesirable extent or may require additional process steps during fabrication, which may increase the complexity and cost of manufacturing the package

Method used

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Examples

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Embodiment Construction

[0038] Embodiments of the invention are described below, by way of example only. These examples represent the best mode currently known to applicants for carrying out the invention, although they are not the only way in which this can be done. This specification sets forth the function of the example and the sequence of steps for constructing and operating the example. However, the same or equivalent functions and sequences may be implemented by different examples.

[0039] Figures 3A-3J A sequence of stages in forming an exemplary package is shown. The exemplary package shown in these figures is a quad flat no-leads (QEN) package, although the techniques can be applied to other types of packages, such as flip chip on leads (FCQFN) packages.

[0040] exist Figure 3A , providing a carrier 21 . The carrier 21 provides support during subsequent stages of the manufacturing process. The carrier 21 is a planar sheet that can be fabricated from any suitable material capable o...

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PUM

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Abstract

An integrated circuit package comprising a semiconductor die, a lead frame lying in a first plane, at least one conductive pillar structure extending outwardly from the first plane, wherein the lead frame and the at least one conductive pillar structure are formed of sintered conductive material, encapsulation material which encapsulates the semiconductor die, the lead frame and the at least one conductive pillar structure, a conductive layer on an upper face of the package, the conductive layer conductively connecting to the at least one conductive pillar. Methods of manufacturing are also disclosed.

Description

Background technique [0001] There is an ever-increasing drive to reduce the size of electronic circuits. A range of integrated circuit packages with reduced form factors has developed. figure 1 An example of a quad flat no-lead (QFN) package 8 is shown. The integrated circuit is provided on a die 2 which is secured to pads 3 by adhesive 4 . In this package, leads 5 are inside the package and contact pads are provided on the lower surface of the package. Wire bonds 6 connect the die to contact pads 5 . This results in a smaller package because the leads 5 do not extend beyond the footprint of the package. [0002] figure 2 A flip chip on leads (FOL) package 10 is shown. The integrated circuit is provided on a die 2 which is secured by solder balls 11 to leads 5 which extend beneath the die 2 and which therefore support the die instead of the die attach pad 3 . The package avoids the need for wire bonding and further reduces the overall size of the package. [0003] Int...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/36H01L23/367H01L23/495H01L23/498H01L23/552H01L21/56H01L21/60H01L23/488H01L23/31
CPCH01L23/36H01L23/3677H01L23/49517H01L23/49541H01L23/49861H01L23/552H01L2224/2919H01L2224/48465H01L2224/48247H01L2224/73265H01L2224/32245H01L2224/92247H01L2224/85639H01L2224/85647H01L2224/85439H01L2224/85447H01L2224/85005H01L2224/83192H01L2224/83005H01L2224/83439H01L2224/83447H01L2224/83647H01L2224/83639H01L2924/00014H01L2924/181H01L23/3107H01L21/568H01L24/48H01L24/32H01L24/29H01L24/92H01L24/85H01L24/83H01L2224/45099H01L2924/00012H01L2924/00H01L2924/15311H01L23/49575H01L23/49827H01L23/522H01L21/32051H01L21/4817H01L21/56H01L23/043H01L23/3675H01L23/49503H01L23/49568H01L2924/01047
Inventor K·坎农
Owner QUALCOMM TECH INT
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