Electron-Programmable Magnetic Transfer Module and Transfer Method for Electronic Components
A technology of electronic components and transfer methods, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., and can solve the problems of low conversion efficiency of color conversion materials, coating uniformity, different lattice constants of the light-emitting layer, and difficult growth.
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no. 1 example
[0050] figure 1 It is a schematic flowchart of a method for transferring electronic components according to an embodiment of the present application. Please refer to figure 1 , The method for transferring electronic components of this embodiment includes the following steps (S10, S20 and S30). First, a plurality of electronic components arranged in an array are formed on a first substrate, wherein each electronic component includes a magnetic portion, and the magnetic portion can be located on the electronic component or embedded in the electronic component (step S10 ). After the first substrate is provided, a part of the electronic components can be selectively picked up from the first substrate by a magnetic force generated by an electronic-programmable magnetic transfer module (step S20). Then, transfer some of the electronic components picked up by the electronic-programmable magnetic transfer module to a second substrate (step S30). In this embodiment, the method for t...
no. 2 example
[0075] Figure 5 for image 3 Block diagram of the control system of the electronic-programmable magnetic transfer module. Please refer to Figure 5 , the control system 300 of the present embodiment includes a computer 310, an electronic control unit 320, a mechanism control unit 330 and a heating control unit 340, wherein the electronic control unit 320, the mechanism control unit 330 and the heating control unit 340 are all electrically connected to the computer 310. For example, the computer 310 and the electronic control unit 320 of this embodiment are used to control the operation of the MEMS chip 210 (such as selectively picking up electronic components, real-time testing, etc.). The computer 310 and the mechanism control unit 330 of this embodiment are used to control the bonding device 220 (shown in image 3 ) movement. In addition, the computer 310 and the heating control unit 340 of this embodiment are used to control the parameters of the heating process durin...
no. 3 example
[0077] Figure 6A to Figure 6K It is a schematic cross-sectional view of the electronic component transfer method according to the second embodiment of the present application.
[0078] Please refer to Figure 6A to Figure 6K The transfer method of the electronic components in this embodiment is similar to that of the first embodiment, except that the preparation of the sacrificial layer 120 in the first embodiment can be omitted in this embodiment. Specifically, after the photoelectric semiconductor layer 100 is bonded to the first substrate S1 by the adhesive 110, since the electrode 102 of this embodiment is a magnetic electrode, it is not necessary to form a sacrificial layer 120 and a magnetic electrode on the surface 100a of the photoelectric semiconductor layer 100. part 130, after that, the photoelectric semiconductor layer 100 and the adhesive 110 will be patterned to form the electronic element ED and a plurality of adhesive patterns 110a (such as Figure 6F shown)...
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