Super light inorganic insulation board
An inorganic thermal insulation board, ultra-light technology, applied in the field of materials, can solve problems such as difficult to apply and popularize in large areas, high density, general thermal insulation performance, etc.
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Examples
Embodiment 1
[0010] Weigh 9 parts of silicon phosphate, 8 parts of silica aerosol, 11 parts of silane coupling agent KH-550, 21 parts of bentonite, and 18 parts of vitrified microbeads. After mixing, add 25 parts of water glass and stir evenly. Put into the mold, curing temperature 90 ℃, curing time 4h, make the insulation board sample of the present invention.
Embodiment 2
[0012] Weigh 8 parts of silicon phosphate, 7 parts of silica aerosol, 12 parts of silane coupling agent KH-550, 20 parts of bentonite, and 16 parts of vitrified microspheres. After mixing, add 24 parts of water glass and stir evenly. Put into the mold, curing temperature 90 ℃, curing time 4h, make the insulation board sample of the present invention.
[0013] Example 2
[0014] (1) Determination of thermal conductivity: The samples made in Examples 1 and 2 and existing commercial samples were put into a DRY300X thermal conductivity tester to measure the thermal conductivity of the samples, and it was found that the thermal conductivity of the samples made in Example 1 was small. (2) Determination of dry density: The samples produced in Examples 1 and 2 and the existing commercial samples were measured according to the provisions of GB / T5486-2008 "Test Methods for Inorganic Rigid Thermal Insulation Products", and it was found that the samples produced in Example 1 The thermal ...
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Abstract
Description
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