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Super light inorganic insulation board

An inorganic thermal insulation board, ultra-light technology, applied in the field of materials, can solve problems such as difficult to apply and popularize in large areas, high density, general thermal insulation performance, etc.

Inactive Publication Date: 2017-11-17
成都市荣山新型材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional inorganic thermal insulation boards, such as gypsum boards, cement boards, vitrified bead boards, steel wire grid cement sandwich boards, etc., have high density and general thermal insulation performance, making it difficult to apply them on a large scale.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] Weigh 9 parts of silicon phosphate, 8 parts of silica aerosol, 11 parts of silane coupling agent KH-550, 21 parts of bentonite, and 18 parts of vitrified microbeads. After mixing, add 25 parts of water glass and stir evenly. Put into the mold, curing temperature 90 ℃, curing time 4h, make the insulation board sample of the present invention.

Embodiment 2

[0012] Weigh 8 parts of silicon phosphate, 7 parts of silica aerosol, 12 parts of silane coupling agent KH-550, 20 parts of bentonite, and 16 parts of vitrified microspheres. After mixing, add 24 parts of water glass and stir evenly. Put into the mold, curing temperature 90 ℃, curing time 4h, make the insulation board sample of the present invention.

[0013] Example 2

[0014] (1) Determination of thermal conductivity: The samples made in Examples 1 and 2 and existing commercial samples were put into a DRY300X thermal conductivity tester to measure the thermal conductivity of the samples, and it was found that the thermal conductivity of the samples made in Example 1 was small. (2) Determination of dry density: The samples produced in Examples 1 and 2 and the existing commercial samples were measured according to the provisions of GB / T5486-2008 "Test Methods for Inorganic Rigid Thermal Insulation Products", and it was found that the samples produced in Example 1 The thermal ...

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PUM

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Abstract

The invention discloses a super light inorganic insulation board, which comprises sodium silicate, silicon phosphate, silica aerosol, a silane coupling agent, bentonite, and vitrified microsphere. The insulation board has the advantages of lightness, high strength, thermal insulation, waterproof performance, and fire resistant property, and thus has a good application prospect.

Description

technical field [0001] The invention relates to the field of materials, in particular to an ultra-light inorganic thermal insulation board. Background technique [0002] At present, 80% of the building maintenance structures in the domestic market use mainly organic materials such as EPS boards, XPS boards, and rigid polyurethane foams. Due to the flammability of the materials themselves, they are listed as B2-level combustible products. Many large-scale fires have sounded the alarm to the world. Therefore, A1 and A2 grade insulation panels are the future development trend of the building insulation industry. However, traditional inorganic insulation boards, such as gypsum boards, cement boards, vitrified bead boards, steel wire grid cement sandwich boards, etc., have high density and general thermal insulation performance, making it difficult to apply them on a large scale. Based on the above reasons, this paper starts from the basic theory and technology of the vitrified...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B28/26C04B111/40
CPCC04B28/26C04B2111/40
Inventor 王志斌付文友
Owner 成都市荣山新型材料有限公司