The invention discloses a high-toughness expanded perlite and phenolic resin composite insulation board, which is prepared from the following raw materials (by weight): 0.8-1 part of iminooxadiazindione, 1.2-1.5 parts of nano-silica, 2.8-3.2 parts of zinc methacrylate, 1-1.5 parts of dicyandiamide, 55-57 parts of expanded perlite, 40-42 parts of phenolic resin, 4-4.1 parts of a curing agent HMTA, 2-2.3 parts of steel fiber, 10-11 parts of tetraethyl orthosilicate, a proper amount of 85wt% ammonia water, a proper amount of anhydrous ethanol, 160-180 parts of deionized water, a proper amount of n-hexane, 4-4.5 parts of nano-polytetrafluoroethylene, 0.1-0.2 part of dicumyl peroxide and 3-3.5 parts of 2,2,2-trifluoroethyl acrylate. By using iminooxadiazindione, nano-silica, zinc methacrylate and dicyandiamide, bonding force of expanded perlite and phenolic resin is boosted, toughness and tensile strength of the insulation board are improved, and heat resistance and ageing resistance of the insulation board are also enhanced.