Heat-resistant expanded perlite and phenolic resin composite insulation board and preparation method thereof
A technology of expanded perlite and phenolic resin, applied in the field of thermal insulation wallboard, can solve the problems of large volume shrinkage and deformation of thermal insulation mortar, high water absorption rate of expanded perlite, affecting thermal insulation performance of wallboard, etc., so as to improve compatibility and bonding force. , Improve the thermal insulation effect, improve the strength effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment Construction
[0014] A heat-resistant expansion perlite phenolic resin composite insulation board, made of the following raw materials in parts by weight (kg): high alumina cotton 1.3, cellulose ether 2.5, phenolic resin closed-cell microspheres 1, multi-walled carbon nanotubes 0.4, Expanded perlite 55, phenolic resin 40, curing agent HMTA4, steel fiber 2, tetraethyl orthosilicate 10, 85wt% ammonia water, anhydrous ethanol, deionized water 160, n-hexane, nano polytetrafluoroethylene 4, Cumyl peroxide 0.1, trifluoroethyl acrylate 3.
[0015] The preparation method of the heat-resistant expansion perlite phenolic resin composite insulation board comprises the following steps:
[0016] (1) Mix expanded perlite with 55 parts by weight of absolute ethanol and deionized water, add cellulose ether, stir and heat to 44°C in a water bath, add 85wt% ammonia water to adjust the pH to 8, continue stirring for 10 minutes, and then add dropwise Ethyl orthosilicate, after the dropwise addition, stir and ...
PUM
Property | Measurement | Unit |
---|---|---|
density | aaaaa | aaaaa |
flexural strength | aaaaa | aaaaa |
compressive strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com