Inorganic composite polyphenyl A level heat-preserving plate

A technology of composite polyphenylene and thermal insulation board, which is applied in thermal insulation, fire protection, building components and other directions, can solve the problems of poor fire performance, loss of thermal insulation effect, loose structure, etc., to achieve enhanced bonding performance, eliminate fire hazards and improve thermal insulation effect Effect

Pending Publication Date: 2019-11-05
山东刚磊建材科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage is that all organic materials have poor fire resistance, which is Class B fire resistance. The thermal expansion and contraction coefficients of organic materials and inorganic cement mortar have a large gap and insufficient bonding ability, which is prone to falling off.
The second type is inorganic material insulation board, rock wool insulation board is widely used,

Method used

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  • Inorganic composite polyphenyl A level heat-preserving plate

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Embodiment Construction

[0029] Below in conjunction with embodiment, further illustrate the present invention.

[0030] see figure 1 It can be seen that the present invention is an inorganic composite polystyrene grade A thermal insulation board, which includes a thermal insulation board (1), and the thermal insulation board includes a common polystyrene board blank (2) and a cement-based inorganic fireproof material (3), and the cement-based Inorganic fireproof materials through the high-pressure vacuum adsorption infiltration process, so that the cement-based inorganic fireproof slurry material is evenly infiltrated around the polystyrene particles to form a honeycomb support skeleton structure, and after a stage of moisturizing and maintenance to form a homogeneous inorganic composite polymer Benzene Class A insulation board.

[0031] Manufacturing process of inorganic composite polystyrene grade A insulation board

[0032] (1) According to the proportion, the fireproof material 15#P.o425 cement...

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Abstract

The invention discloses an inorganic composite polyphenyl A level heat-preserving plate. A heat preserving plate body is included, and comprises a common polystyrene plate blank material and a cement-based inorganic fireproof material; the cement-based inorganic fireproof material makes a cement-based inorganic fireproof pulp-shape material uniformly permeate to the position around polystyrene particles and wrap the position around the polystyrene particles, and a honeycomb-shaped supporting framework structure is formed; and the homogenous inorganic composite polyphenyl A level heat-preserving plate is formed due to moisture preserving and maintaining curing in one stage.

Description

technical field [0001] The invention relates to the field of construction equipment, and more precisely, the invention relates to an inorganic composite polystyrene grade A insulation board and a production method thereof. Background technique [0002] It is well known that fires broke out in Shanghai and Shenyang because of thermal insulation materials, but the direct cause of the fire was sparks generated by workers welding steel keels when dry-hanging stone materials. In fact, thousands of insulation board fires occur every year due to electric welding. The insulation materials used are polystyrene boards, extruded boards, polyurethane, phenolic boards, real gold boards, etc., and their fire ratings are Class B. In addition, many domestic insulation walls that have been completed have problems with the insulation layer falling off. One of the reasons is that the ability to stain dust is insufficient. The second is that the thermal expansion and contraction coefficient of...

Claims

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Application Information

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IPC IPC(8): E04B1/80E04B1/94C04B28/04
CPCE04B1/80E04B1/942C04B28/04C04B2111/28C04B2103/0068C04B14/02C04B14/06Y02A30/242Y02B80/10
Inventor 王刚
Owner 山东刚磊建材科技有限公司
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