Expanded perlite and phenolic resin composite insulation board with good heat resistance and preparation method thereof

A technology of expanded perlite and phenolic resin, which is applied in the field of thermal insulation wall panels, can solve the problems of large volume shrinkage and deformation of thermal insulation mortar, high water absorption rate of expanded perlite, and affect the thermal insulation performance of wall panels, so as to improve compatibility and binding force , Improve water resistance, improve the effect of heat preservation

Inactive Publication Date: 2016-09-28
DANGTU COUNTY KEHUI TRADING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, expanded perlite has a high water absorption rate and poor water resistance, which leads to large volume shrinkage and deformation of the thermal insulation mortar during mixing, and the thermal insulation performance of the product is reduced in the later stage, and the bonding strength with the matrix is ​​low, which affects the thermal insulation performance of the wallboard in the later stage.

Method used

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Examples

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Effect test

Embodiment Construction

[0015] An expanded perlite phenolic resin composite insulation board with good heat resistance is made of the following raw materials in parts by weight (kg): 1.3 dilauric silicon thiodipropionate, 2.6 ferrocene boric acid, and 1.2 β-glucan , activated carbon 3, expanded perlite 55, phenolic resin 40, curing agent HMTA4, steel fiber 2, tetraethyl orthosilicate 10, 85wt% ammonia water, anhydrous ethanol, deionized water 160, n-hexane Vinyl fluoride 4, cumene peroxide 0.1, trifluoroethyl acrylate 3.

[0016] The preparation method of the expanded perlite phenolic resin composite insulation board with good heat resistance comprises the following steps:

[0017] (1) Grind the activated carbon, add 2 times the weight of absolute ethanol, heat to 85°C, keep warm and stir for 20 minutes, then add February silicone thiodipropionate and β-glucan, stir evenly, and continue to keep warm Stir until dry to obtain a powder;

[0018] (2) Mix expanded perlite with 55 parts by weight of abso...

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PUM

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Abstract

The invention discloses an expanded perlite and phenolic resin composite insulation board with good heat resistance. The composite insulation board is prepared from the following raw materials (by weight): 1.3-1.6 parts of dilauryl thiodipropionate, 2.6-2.9 parts of ferroceneboronic acid, 1.2-1.4 parts of beta-glucan, 3-3.5 parts of active carbon, 55-57 parts of expanded perlite, 4-4.1 parts of a curing agent HMTA, 2-2.3 parts of steel fiber, 10-11 parts of tetraethyl orthosilicate, a proper amount of 85wt% ammonia water, a proper amount of anhydrous ethanol, 160-180 parts of deionized water, a proper amount of n-hexane, 4-4.5 parts of nano-polytetrafluoroethylene, 0.1-0.2 part of dicumyl peroxide and 3-3.5 parts of 2,2,2-trifluoroethyl acrylate. By using dilauryl thiodipropionate and beta-glucan for modification of active carbon, heat resistance and heat insulating property of the insulation board can be enhanced. By using ferroceneboronic acid, heat resistance of the insulation board is boosted, and reduction of heat insulating property due to water adsorption is prevented.

Description

technical field [0001] The invention relates to the technical field of thermal insulation wall panels, in particular to an expanded perlite phenolic resin composite thermal insulation panel with good heat resistance and a preparation method thereof. Background technique [0002] Composite insulation materials (CompositeInsulationMaterials) are new materials that are uniformly composited by two or more insulation materials, usually referring to the composite of organic insulation materials and inorganic insulation materials, which have better performance than the original organic or inorganic materials. This paper makes full use of the advantages of abundant perlite mineral resources in Xinyang, uses expanded perlite (Expended Perlite, EP) and phenolic resin (Phenol-formaldchyde Resin, PF) as the main raw materials, and adds an appropriate amount of curing agent, toughening agent and hydrophobic agent. agent, hot-pressed under certain conditions, prepared into expanded perlit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/12C04B20/10C04B20/02B29C43/56B29C43/58B29L7/00
CPCB29C43/56B29C43/58B29C2043/561B29C2043/5808B29C2043/5816B29L2007/002C04B20/023C04B20/1033C04B26/122C04B14/185C04B14/48
Inventor 董良清
Owner DANGTU COUNTY KEHUI TRADING
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