Antistatic expanded perlite and phenolic resin composite insulation board and preparation method thereof
A technology of expanded perlite and phenolic resin is applied in the field of thermal insulation wallboard, which can solve the problems of large volume shrinkage and deformation of thermal insulation mortar, high water absorption rate of expanded perlite, affecting thermal insulation performance of wallboard, etc., so as to improve compatibility and bonding force. , Improve the thermal insulation effect, improve the strength effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment Construction
[0014] An antistatic expanded perlite phenolic resin composite insulation board, made of the following raw materials in parts by weight (kg): lithium polyphenylene ether sulfonate 1.3, magnesium carbonate 2.3, nano carbon sol 3.6, erucamide 0.4, expanded perlite 55. Phenolic resin 40, curing agent HMTA4, steel fiber 2, tetraethyl orthosilicate 10, appropriate amount of 85wt% ammonia water, appropriate amount of absolute ethanol, deionized water 160, appropriate amount of n-hexane, nano polytetrafluoroethylene 4, isoperoxide Propylbenzene 0.1, trifluoroethyl acrylate 3.
[0015] The preparation method of the antistatic thermal expansion perlite phenolic resin composite insulation board comprises the following steps:
[0016] (1) Mix expanded perlite with 55 parts by weight of absolute ethanol and deionized water, add lithium polyphenylene ether sulfonate and nano carbon sol, stir and heat to 44°C in a water bath, add 85wt% ammonia water to adjust the pH to 8 , continue to stir...
PUM
Property | Measurement | Unit |
---|---|---|
density | aaaaa | aaaaa |
flexural strength | aaaaa | aaaaa |
compressive strength | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com