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Antistatic expanded perlite and phenolic resin composite insulation board and preparation method thereof

A technology of expanded perlite and phenolic resin is applied in the field of thermal insulation wallboard, which can solve the problems of large volume shrinkage and deformation of thermal insulation mortar, high water absorption rate of expanded perlite, affecting thermal insulation performance of wallboard, etc., so as to improve compatibility and bonding force. , Improve the thermal insulation effect, improve the strength effect

Inactive Publication Date: 2016-09-28
DANGTU COUNTY KEHUI TRADING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, expanded perlite has a high water absorption rate and poor water resistance, which leads to large volume shrinkage and deformation of the thermal insulation mortar during mixing, and the thermal insulation performance of the product is reduced in the later stage, and the bonding strength with the matrix is ​​low, which affects the thermal insulation performance of the wallboard in the later stage.

Method used

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Embodiment Construction

[0014] An antistatic expanded perlite phenolic resin composite insulation board, made of the following raw materials in parts by weight (kg): lithium polyphenylene ether sulfonate 1.3, magnesium carbonate 2.3, nano carbon sol 3.6, erucamide 0.4, expanded perlite 55. Phenolic resin 40, curing agent HMTA4, steel fiber 2, tetraethyl orthosilicate 10, appropriate amount of 85wt% ammonia water, appropriate amount of absolute ethanol, deionized water 160, appropriate amount of n-hexane, nano polytetrafluoroethylene 4, isoperoxide Propylbenzene 0.1, trifluoroethyl acrylate 3.

[0015] The preparation method of the antistatic thermal expansion perlite phenolic resin composite insulation board comprises the following steps:

[0016] (1) Mix expanded perlite with 55 parts by weight of absolute ethanol and deionized water, add lithium polyphenylene ether sulfonate and nano carbon sol, stir and heat to 44°C in a water bath, add 85wt% ammonia water to adjust the pH to 8 , continue to stir...

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PUM

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Abstract

The invention discloses an antistatic expansion perlite phenolic resin composite insulation board, which is made of the following raw materials in parts by weight: polyphenylene ether sulfonate lithium 1.3-1.8, magnesium carbonate 2.3-2.6, nano carbon sol 3.6-3.9, mustard Acid amide 0.4‑0.6, expanded perlite 55‑57, phenolic resin 40‑42, curing agent HMTA4‑4.1, steel fiber 2‑2.3, tetraethyl orthosilicate 10‑11, 85wt% ammonia water, absolute ethanol, Deionized water 160‑180, appropriate amount of n-hexane, nano-polytetrafluoroethylene 4‑4.5, cumene peroxide 0.1‑0.2, trifluoroethyl acrylate 3‑3.5. The invention uses polyphenylene ether sulfonate lithium, magnesium carbonate, nano-carbon sol, and erucamide to make the heat preservation board have good antistatic properties, and to improve the heat resistance and compressive strength of the heat preservation board.

Description

technical field [0001] The invention relates to the technical field of thermal insulation wall panels, in particular to an antistatic expansion perlite phenolic resin composite thermal insulation panel and a preparation method thereof. Background technique [0002] Composite insulation materials (CompositeInsulationMaterials) are new materials that are uniformly composited by two or more insulation materials, usually referring to the composite of organic insulation materials and inorganic insulation materials, which have better performance than the original organic or inorganic materials. This paper makes full use of the advantages of abundant perlite mineral resources in Xinyang, uses expanded perlite (Expended Perlite, EP) and phenolic resin (Phenol-formaldchyde Resin, PF) as the main raw materials, and adds an appropriate amount of curing agent, toughening agent and hydrophobic agent. agent, hot-pressed under certain conditions, prepared into expanded perlite / phenolic res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B26/12C04B20/10C04B14/02C04B14/18C04B14/48C04B22/00C04B22/10C04B24/00C04B24/02C04B24/04C04B24/12C04B24/16C04B24/26C04B24/42
CPCC04B26/122C04B20/1051
Inventor 董良清
Owner DANGTU COUNTY KEHUI TRADING
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