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High-toughness expanded perlite and phenolic resin composite insulation board and preparation method thereof

A technology of expanded perlite and phenolic resin, applied in the field of thermal insulation wallboard, can solve the problems of large volume shrinkage and deformation of thermal insulation mortar, high water absorption rate of expanded perlite, affecting thermal insulation performance of wallboard, etc., so as to improve compatibility and bonding force. , Improve the thermal insulation effect, improve the strength effect

Inactive Publication Date: 2016-09-28
DANGTU COUNTY KEHUI TRADING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, expanded perlite has a high water absorption rate and poor water resistance, which leads to large volume shrinkage and deformation of the thermal insulation mortar during mixing, and the thermal insulation performance of the product is reduced in the later stage, and the bonding strength with the matrix is ​​low, which affects the thermal insulation performance of the wallboard in the later stage.

Method used

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Embodiment Construction

[0014] A high-toughness expanded perlite phenolic resin composite insulation board, made of the following raw materials in parts by weight (kg): 0.8 iminooxadiazinedione, 1.2 nanometer silicon dioxide, 2.8 zinc methacrylate, and 1 dicyandiamide , expanded perlite 55, phenolic resin 40, curing agent HMTA4, steel fiber 2, tetraethyl orthosilicate 10, appropriate amount of 85wt% ammonia water, appropriate amount of absolute ethanol, deionized water 160, appropriate amount of n-hexane, nanometer polytetrafluoroethylene 4 , cumene peroxide 0.1, trifluoroethyl acrylate 3.

[0015] The preparation method of the thermal expansion perlite phenolic resin composite insulation board with good toughness comprises the following steps:

[0016] (1) Mix expanded perlite with 55 parts by weight of absolute ethanol and deionized water, add nano silicon dioxide and zinc methacrylate, stir and heat to 44°C in a water bath, add 85 wt% ammonia water to adjust the pH to 8, After continuing to stir ...

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PUM

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Abstract

The invention discloses a high-toughness expanded perlite and phenolic resin composite insulation board, which is prepared from the following raw materials (by weight): 0.8-1 part of iminooxadiazindione, 1.2-1.5 parts of nano-silica, 2.8-3.2 parts of zinc methacrylate, 1-1.5 parts of dicyandiamide, 55-57 parts of expanded perlite, 40-42 parts of phenolic resin, 4-4.1 parts of a curing agent HMTA, 2-2.3 parts of steel fiber, 10-11 parts of tetraethyl orthosilicate, a proper amount of 85wt% ammonia water, a proper amount of anhydrous ethanol, 160-180 parts of deionized water, a proper amount of n-hexane, 4-4.5 parts of nano-polytetrafluoroethylene, 0.1-0.2 part of dicumyl peroxide and 3-3.5 parts of 2,2,2-trifluoroethyl acrylate. By using iminooxadiazindione, nano-silica, zinc methacrylate and dicyandiamide, bonding force of expanded perlite and phenolic resin is boosted, toughness and tensile strength of the insulation board are improved, and heat resistance and ageing resistance of the insulation board are also enhanced.

Description

technical field [0001] The invention relates to the technical field of thermal insulation wall panels, in particular to a high-toughness expanded perlite phenolic resin composite thermal insulation panel and a preparation method thereof. Background technique [0002] Composite insulation materials (CompositeInsulationMaterials) are new materials that are uniformly composited by two or more insulation materials, usually referring to the composite of organic insulation materials and inorganic insulation materials, which have better performance than the original organic or inorganic materials. This paper makes full use of the advantages of abundant perlite mineral resources in Xinyang, uses expanded perlite (Expended Perlite, EP) and phenolic resin (Phenol-formaldchyde Resin, PF) as the main raw materials, and adds an appropriate amount of curing agent, toughening agent and hydrophobic agent. agent, hot-pressed under certain conditions, prepared into expanded perlite / phenolic r...

Claims

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Application Information

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IPC IPC(8): C04B26/12C04B20/10C04B14/18C04B38/08C04B111/20
CPCC04B14/185C04B20/1018C04B20/1033C04B26/122C04B38/08C04B2111/2084C04B2201/20C04B2201/32C04B2201/50C04B24/121C04B14/48
Inventor 董良清
Owner DANGTU COUNTY KEHUI TRADING
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