High-toughness expanded perlite and phenolic resin composite insulation board and preparation method thereof
A technology of expanded perlite and phenolic resin, applied in the field of thermal insulation wallboard, can solve the problems of large volume shrinkage and deformation of thermal insulation mortar, high water absorption rate of expanded perlite, affecting thermal insulation performance of wallboard, etc., so as to improve compatibility and bonding force. , Improve the thermal insulation effect, improve the strength effect
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[0014] A high-toughness expanded perlite phenolic resin composite insulation board, made of the following raw materials in parts by weight (kg): 0.8 iminooxadiazinedione, 1.2 nanometer silicon dioxide, 2.8 zinc methacrylate, and 1 dicyandiamide , expanded perlite 55, phenolic resin 40, curing agent HMTA4, steel fiber 2, tetraethyl orthosilicate 10, appropriate amount of 85wt% ammonia water, appropriate amount of absolute ethanol, deionized water 160, appropriate amount of n-hexane, nanometer polytetrafluoroethylene 4 , cumene peroxide 0.1, trifluoroethyl acrylate 3.
[0015] The preparation method of the thermal expansion perlite phenolic resin composite insulation board with good toughness comprises the following steps:
[0016] (1) Mix expanded perlite with 55 parts by weight of absolute ethanol and deionized water, add nano silicon dioxide and zinc methacrylate, stir and heat to 44°C in a water bath, add 85 wt% ammonia water to adjust the pH to 8, After continuing to stir ...
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