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Modular IC test bench and IC test device

A modular and test seat technology, which is applied in the direction of measuring devices, measuring device casings, electronic circuit testing, etc., can solve the problem of single chip size, achieve strong versatility, reduce follow-up maintenance and development costs, and reduce testing costs.

Active Publication Date: 2017-11-17
深圳文治电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a modular IC test socket, aiming at improving the problem of single chip size in test equipment application

Method used

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  • Modular IC test bench and IC test device
  • Modular IC test bench and IC test device
  • Modular IC test bench and IC test device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0039] Please refer to Figure 1-Figure 2 The embodiment of the present invention provides a modular IC test socket 100a, including a base 110 and a module assembly 120 for connecting the IC 130 under test and the test circuit. Position sheet 122 and a plurality of elastic sheets 124 for connecting the IC130 under test and the test circuit, each limiting sheet 122 is provided with a plurality of first limiting through holes 126 matched with elastic sheet 124, a plurality of limiting sheets The through-hole matrix formed by the first limiting through-holes 126 of 122 is adapted to the position of the tested IC 130 , and the bottom wall of the base 110 is provided with a first channel notch 112 for the shrapnel 124 to protrude and contact the test circuit.

[0040] It should be noted that, in the embodiment of the present invention, a plurality of interfitting limiting pieces 122 are fixed on the base 110, and a plurality of first limiting through holes 126 that cooperate with t...

no. 2 example

[0050] Please refer to Figure 6-Figure 8 , the modularized IC test socket 100b provided by the second embodiment of the present invention, its realization principle and the technical effect produced are roughly the same as those of the first embodiment. Corresponding content in the embodiment. The difference is that the modularized IC test socket 100b provided by this embodiment has a higher degree of automation and is easy to operate.

[0051] Further, the modularized IC test socket 100b also includes an upper cover 140 and an elastic briquetting assembly 150 for applying pressure to the IC 130 under test. Rotate connection, when the upper cover 140 is closed, the elastic pressing block assembly 150 shrinks and exerts pressure on the IC 130 under test through the bottom of the elastic pressing block assembly 150 . When testing, closing the upper cover 140 can cause the elastic pressing block assembly 150 to shrink, and the bottom of the elastic pressing block assembly 150 ...

no. 3 example

[0066] Please refer to Figure 12-Figure 13 , the modular IC test socket 100c provided by the third embodiment of the present invention, its realization principle and the technical effect produced are roughly the same as those of the second embodiment. Corresponding content in the embodiment. The difference lies in that an adapter circuit board 1106 is fixed at the bottom of the base 110 of the modular IC test socket 100c provided in this embodiment.

[0067] Further, the modular IC test socket 100c also includes a transfer circuit board 1106 , and the transfer circuit board 1106 is fixed on the bottom of the base 110 . The process of bridging the IC 130 under test and the test circuit can be realized by welding the test circuit and the transfer circuit board 1106 together with the elastic piece 124 .

[0068] It should be noted that the modular IC test socket 100b provided in the second embodiment has certain requirements for the fixed position of the test circuit, which ca...

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Abstract

The invention provides a modular IC test bench and an IC test device, and relates to the technical field of chip testing. The modular IC test bench includes a base and a module assembly for connecting a tested IC and a test circuit. The module assembly includes a plurality of stoppers fixed to the base and adhering to one another and a plurality of springs for connecting the tested IC and the test circuit. Each stopper is provided with a plurality of first stopping through holes matching the springs. A through hole matrix formed by the first stopping through holes of the plurality of stoppers adapts to the point of the tested IC. The bottom wall of the base is provided with a first channel gap for the springs to stick out to be in contact with the test circuit. By adjusting the number of the stoppers and the number of the springs in the stoppers, the through hole matrix formed by the first stopping through holes adapts to the potential of the tested IC and the ICs with different sizes can be tested. The IC test device includes the modular IC test bench, can adapt to ICs with different sizes, and is good in universality.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a modular IC testing socket and an IC testing device. Background technique [0002] Function and performance tests are required after chip production. The main purpose of device testing is to ensure that the device can fully realize the functions and performance indicators specified in the design specifications under harsh environmental conditions. [0003] But, every kind of IC test socket can only be applied to the chip of a kind of package size in the market at present, and the chip of different size needs different IC test sockets, can not realize the multiplexing of different package size products. This largely results in an increase in testing costs and subsequent maintenance and development costs. Contents of the invention [0004] The object of the present invention is to provide a modularized IC test socket, aiming at improving the problem of single chip size for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/04
CPCG01R31/2886
Inventor 张咪
Owner 深圳文治电子有限公司