Glue point inspection method and device

An inspection method and inspection device technology, which is applied in the field of image processing, can solve problems such as difficulty in whether the glue point is qualified, easy misjudgment, fatigue, etc., and achieve the effect of avoiding whether the glue point is qualified and saving labor costs

Inactive Publication Date: 2017-11-17
上海视马艾智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the process of realizing the present invention, the inventors found that there are at least the following problems in the prior art: on the one hand, each production line is equipped with manpower, and the day and night shifts take turns to check whether the glue spots on the product surface are qualified, resulting in high labor costs. At the same time, Human fatigue due to long-term work i

Method used

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  • Glue point inspection method and device

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Embodiment Construction

[0016] In order to make the object, technical solution and advantages of the present invention clearer, various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that, in each implementation manner of the present invention, many technical details are provided for readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following implementation modes, the technical solution claimed in this application can also be realized.

[0017] The first embodiment of the present invention relates to a glue point inspection method, such as figure 1 shown, including:

[0018] Step 101: Obtain a first image of the surface of the object to be inspected.

[0019] Specifically, the terminal can call the camera software interface to take pictures of the object to be inspected w...

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Abstract

The invention relates to the field of image processing, and discloses a glue point inspection method and device. The glue point inspection method comprises the steps of acquiring a first image of the surface of an object to be inspected; separating a glue point in the first image of the surface of the object to be inspected from the background to obtain a second image with the background being removed; and judging whether the glue point in the second image is qualified or not, and displaying a judgment result. The embodiment of the invention further provides a glue point inspection device. Whether the glue point at the surface of the object to be inspected is qualified or not can be effectively inspected according to the invention. Meanwhile, the labor cost can be saved.

Description

technical field [0001] The invention relates to the field of image processing, in particular to a glue point inspection method and device. Background technique [0002] Glue dispensing is usually the application, potting, and dripping of electronic glue, oil or other liquids on the product, so that the product can play the role of sticking, potting, insulating, fixing, and smoothing the surface. Since dispensing will significantly improve the reliability and life of products, with the rapid development of electronic products, the requirements for dispensing are getting higher and higher. The inspection of glue spots on the surface of products has gradually become an indispensable part of improving product quality. ring. The existing technology mainly adopts manual detection, and manually uses tools such as a magnifying glass to observe whether the glue spots on the surface of the product are qualified, so as to judge whether the product is qualified. [0003] In the proces...

Claims

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Application Information

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IPC IPC(8): G06T7/00G06T7/136G06T7/194G06T5/00
CPCG06T5/002G06T7/0004G06T7/136G06T7/194G06T2207/20036G06T2207/20182G06T2207/30164
Inventor 戴明航
Owner 上海视马艾智能科技有限公司
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