Encapsulation method for organic light emitting diode display panel

Abstract

The invention relates to a packaging method for a light-emitting diode display panel. The method comprises: coating glass glue on a pre-treated packaging glass substrate, and the coated glass glue forms and surrounds a light-emitting diode arranged on the display glass substrate The closed loop of the array; the polymer resin is coated on the first side of the glass glue on the packaging glass substrate; the packaging glass substrate is aligned with the display glass substrate provided with the light-emitting diode array, so that the light-emitting diode array is placed on the glass glue and In the space surrounded by high-group resin; the glass glue and polymer resin are cured by laser, and the laser spot size covers the glass glue and polymer resin; the energy of the laser spot satisfies the highest energy in the center of the spot, and the energy from the center of the spot to the sides Decrease gradually. The water and oxygen barrier of the organic light emitting diode display panel is realized, the impact resistance of the organic light emitting diode display panel is improved, the curing process and cost are reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of product packaging, in particular to a packaging method for an organic light emitting diode display panel. Background technique [0002] Organic Light-Emitting Diode (OLED), also known as Organic Electroluminescence Display, has become increasingly Favored by the market, OLED displays have been widely used in terminal products. However, since organic materials in OLEDs are prone to aging and failure when exposed to water and oxygen, the OLED display panel packaging requires a water vapor transmission rate of less than 10-6g / m2 / day and an oxygen transmission rate of less than 10 -5g / m2 / day. [0003] However, traditional polymer resins are difficult to meet the water and oxygen isolation requirements of OLED display panels as encapsulation materials, and desiccants need to be filled to remove water and oxygen that penetrate the polymer resin and enter the panel. At present, the panel industry generally uses glass g...

AI Technical Summary

Problems solved by technology

However, since organic materials in OLEDs are prone to aging and failure when exposed to water and oxygen, the OLED display panel packaging requires a water vapor transmission rate of less than 10-6g / m2 / day and an oxygen transmission rate of less than 10 -5g / m2 / day

[0003] However, traditional polymer resins are difficult to meet the water and oxygen isolation requirements of OLED display panels as encapsulation materials, and desiccants need to be filled to remove water and oxygen that penetrate the polymer resin and enter the panel.

At present, the panel industry generally uses glass glue as the encapsulation material for OLED display panels. The upper and lower layers of glass are bonded by laser sintering and curing. However, since the main components of glass glue are glass powder and ceramic powder, it is fragile after laser curing.

The OLED display terminal products encapsulated with glass glue, such as mobile phones or tablets, will easily cause cracks in the packaging area of ​​the OLED panel when dropped, and water and oxygen will penetrate into the OLED panel, causing the organic material to age and fail, which will cause serious adverse phenomena such as black screen or blurred screen. The use of glass glue cannot well meet the water and oxygen isolation requirements of OLED display panels

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