Device for acquiring appearance image of electronic component and acquiring method thereof

Abstract

A device for acquiring an appearance image of an electronic component comprises four units, namely, two hardware units including an image acquiring unit and a movement control unit, and two software units including an image handling unit and an information management unit. An acquiring method of the device comprises the following steps: 1, measuring the height of the electronic component; 2, measuring the length and width of the electronic component; 3, acquiring an inclination side image of the electronic component; 4, acquiring an end surface image of the electronic component; 5, acquiring a side surface image of the electronic component. According to the method, the abovementioned steps are performed, and the abovementioned device is adopted, on that basis, the size of the electronic component is measured, and then the device automatically moves according to the size information, thereby realizing high-resolution and automatic acquiring of the electronic device with different size, as well as standard acquiring of the electronic element with same model and different batch.

Description

(1) Technical field [0001] The invention relates to a device and method for collecting appearance images of electronic components, and belongs to the technical field of electronic appliances and information processing. (2) Background technology [0002] With the continuous development of the information age, various fields are constantly innovating, which has also brought huge market demand and development space to the electronics industry, and promoted the rapid development of the electronic components industry. However, with the substantial increase in the number and variety of electronic components, it has also caused difficulties in its detection work. [0003] The appearance inspection of electronic components is the first process of inspection work. In order to improve the stability and traceability of the appearance inspection work, it is usually necessary to collect appearance images of electronic components. The conventional method is to collect images by hand-hel...

AI Technical Summary

Problems solved by technology

[0004] First, because electronic components are ordered in batches, it is difficult for quality inspection operators to collect images of the same model and different batches of electronic components with the same shooting parameters such as magnification, shooting angle, and light source brightness. The difference in the image will affect the progress of the detection work and cause unnecessary waste of work

[0005] Second, due to the differences in the size of electronic components, such as the difference between a larger module device and a smaller surface mount device, it is often difficult to meet the requirements of different sizes due to the limitation of shooting equipment. Shooting needs

When collecting images of large-sized electronic components, it is necessary to reduce the magnification to increase the observation field of view so that the target fills the entire field of view, but at the same time it also reduces the spatial resolution of the image of the target object; when collecting images of small-sized electronic components , it is necessary to increase the magnification to reduce the observation field of view, so that the target fills the entire field of view, which reduces the stability of shooting. The breathing airflow and air fluctuations have a greater impact on shooting, and it may also happen that no clear target image can be collected. Happening

[0006] To sum up, the current manual hand-held shooting equipment to collect images has the problems of large chance and poor size adaptability

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