Flexible printed circuit (FPC) winding method, bearing device and cloud platform

Abstract

The invention provides a flexible printed circuit (FPC) winding method, a bearing device and a cloud platform. The FPC winding method is used for electrical connection of a carrier device and involves a multi-layer FPC, wherein the multi-layer FPC is arranged in a lamination way and is wound around the carrier device to form a winding structure, the winding structure is provided with at least one pair of internal force offset units, each internal force offset unit comprises a first bending part and a second bending part, and the bending directions of the first bending part and the second bending part are opposite. The invention also provides the bearing device and the cloud platform which employ the FPC winding method. With the adoption of the FPC winding method, the first bending part and the second bending part are used for offsetting an internal force formed by a bending inner side of the multi-layer FPC during moving of the carrier device, the impedance of the multi-layer FPC during following motion is reduced, so that the stability of the carrier device is higher, and the motion accuracy of the carrier device is improved; and moreover, the multi-layer FPC cannot be wound in a mess mode, and the integral structure is more regular.

Description

technical field [0001] The invention relates to the field of flexible circuit boards, in particular to an FPC winding method, a carrying device and a platform. Background technique [0002] Flexible Printed Circuit (FPC) has the characteristics of high wiring density, light weight, and thin thickness. It is mainly used in many products such as mobile phones, notebook computers, handheld computers, digital cameras, liquid crystal display modules, and gimbals. [0003] see figure 1 and figure 2 , the existing gimbals usually use flexible circuit boards to electrically connect various components (such as: motors, inertial measurement units (IMU), cameras (imaging modules), PCB boards), but as gimbals gradually With miniaturization and the increasing number of transmission lines, single-layer flexible circuit boards can no longer meet the requirements of existing data transmission, and multi-layer flexible circuit boards are widely used. This kind of multi-layer flexible cir...

AI Technical Summary

Problems solved by technology

[0003] see figure 1 and figure 2 , the existing gimbals usually use flexible circuit boards to electrically connect various components (such as: motors, inertial measurement units (IMU), cameras (imaging modules), PCB boards), but as gimbals gradually With miniaturization and the increasing number of transmission lines, single-layer flexible circuit boards can no longer meet the requirements of existing data transmission, and multi-layer flexible circuit boards are widely used

This kind of multi-layer flexible circuit board can be bonded by glue to form a one-layer flexible circuit board for use. However, the electrical connection of the moving part of the pan / tilt adopts the above-mentioned multi-layer integrated FPC or multi-layer Layer FPC, during the forward and reverse process of the motor of the gimbal, the FPC pre-wound on the shaft is wound or unwound. For the integrated FPC, it is thicker and harder than the multi-layer FPC due to the adhesive bonding. Harder, it is not suitable for winding or unwinding during the rotation of the shaft; in the case of multi-layer FPC cable stacking, due to the inconsistency of the lengths required for the inner and outer layers of the FPC during the rotation process, the stacking will cause the stacking part to affect the motor. The torque of the torque produces unstable resistance, which makes the torque demand of the motor fluctuate, resulting in unstable rotation of the motor and reducing the accuracy of the overall drive

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