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Electronic device

A technology of electronic equipment and terminals, which is applied in the field of electronic equipment and can solve problems such as damage to sealing performance

Active Publication Date: 2017-11-28
ORMON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, during electrical connection, the molten solder invades into the gap between the outer surface of the insulating base 3005 and the inner peripheral surface of the cover 51 due to capillary action, contacts the sealant 45, and damages the sealing performance.

Method used

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Experimental program
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Effect test

Embodiment Construction

[0057] refer to Figure 1 to Figure 19 Embodiments of the electronic device of the present invention will be described.

[0058] Such as Figure 1 to Figure 7 As shown, the first embodiment is applied to an electromagnetic relay, and has an insulating base 10 , a movable contact piece 30 , and a cover 40 .

[0059] Such as figure 1As shown, the insulating base 10 is insert-molded with a gate-shaped cross-section iron core 13 wound with a coil (not shown), and its molding material contains basic polymer, filler and metal powder. Examples of the basic polymer include liquid crystal polymer (LCP) and polybutylene terephthalate (PBT). Furthermore, the insulating base 10 is provided with a pair of support protrusions 11, 11 protruding from the center of the bottom surface thereof. Common electrodes 12a, 12b are disposed on both sides of the supporting protrusions 11, 11. In addition, the magnetic pole portions 13a, 13b of the iron core 13 are exposed at positions facing each ...

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PUM

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Abstract

Provided is an electronic device in which molten solder does not contact a sealing material, and there is no damage to the sealing function. To this end, this electronic device has: an insulating base 10 mounted to a printed circuit board 51; a common planar terminal 20 that is provided continuously from the outside surface of the insulating base 10 to the floor-surface edge section thereof, and conducts between the outside surface of the insulating base 10 and the floor-surface edge section thereof; a cover 40 which is fitted onto the insulating base 10, and covers the common planar terminal 20; and a sealing material 50 for sealing the gap between the outside surface of the insulating base 10 and the inner-circumferential surface of the cover 40. A solder pool section 23 is formed in a location surrounded by the printed circuit board 51 and the common planar terminal 20 in the floor-surface edge section of the insulating base 10.

Description

technical field [0001] The present invention relates to electronic devices, and in particular, to electronic devices surface-mounted on printed substrates via solder. Background technique [0002] Conventionally, as an electronic device surface-mounted on a printed circuit board, there is, for example, a leadless surface-mount relay. The electromagnetic relay includes: a coil assembly having an iron core; a coil reel provided inside with a part of the iron core exposed; A coil wound on a coil reel; an armature assembly, which has an armature that makes one end of itself abut at least one end of the iron core, a movable contact spring that has at least one movable contact at the front end, and A supporting body composed of an insulator supporting the armature and the movable contact spring; an insulating base having at least one fixed contact opposite to the movable contact, a fixed contact terminal holding the fixed contact, and inside accommodating the coil assembly; a cov...

Claims

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Application Information

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IPC IPC(8): H01H9/02H01H45/04
CPCH01H50/043H01H51/229H01H2001/5888H01H50/023H01H50/047H01H50/14H05K1/181H05K2201/10053H05K2201/1078H05K2201/10803H05K2201/10931
Inventor 下田城毅阿部正章
Owner ORMON CORP
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