PC terminal and heat dissipation device thereof

Abstract

The invention relates to a PC terminal and a heat dissipation device thereof. The heat dissipation device comprises a liquid storage tank, a liquid cooling head and a heat dissipation mechanism, the liquid storage tank comprises a tank body and a bottom plate, and the tank body is internally provided with a liquid storage tank and a first channel; a liquid adding hole sealed with sealant is formed in the tank body, and the heat dissipation mechanism comprises a cooling base, a turbine fan and a pump body; a heating electronic element transmits heat to cooling liquid through the liquid cooling head, the temperature of the cooling liquid increases, the pump body makes the cooling liquid enter the first channel through a first liquid inlet, and the turbine fan generates wind power to take away the heat of the cooling liquid, so that the cooling liquid is cooled; the cooling liquid enters the pump body through a first liquid outlet, the pump body drives the cooling liquid to enter a second channel through a second liquid inlet, flows out of the heat dissipation mechanism through a second liquid outlet and enter the first channel, the cooling liquid returns to the liquid storage tank to form a cooling loop, and the cooling liquid can be recycled. The liquid adding hole is formed in the tank body of the liquid storage tank, and the cooling liquid is added into the liquid storage tank through the liquid adding hole so that the cooling effect of the liquid storage tank can be effectively ensured.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic products, in particular to a PC terminal and a heat dissipation device thereof. Background technique [0002] The cooling device in a traditional notebook computer generally uses a heat pipe to conduct heat, and then uses a fan to dissipate the heat, thereby cooling the heat-generating electronic components such as the CPU and GPU in the computer. [0003] As people's requirements for notebook configuration are getting higher and higher, the heat generation of electronic components is greater. Electronic components work in a high temperature environment for a long time, which has a great impact on their life, and may even lead to direct burning and other losses. Due to the limitations of the physical properties of the heat pipe, the coolant contained in it will volatilize after a long period of use, which will affect its heat conduction effect, or even fail completely. Con...

AI Technical Summary

Problems solved by technology

[0003] As people's requirements for notebook configuration are getting higher and higher, the heat generation of electronic components is greater. Electronic components work in a high temperature environment for a long time, which has a great impact on their life, and may even lead to direct burning and other losses.

Due to the limitation of physical properties of the heat pipe, the coolant contained in it will volatilize after a long time of use, which will affect its heat conduction effect, or even fail completely

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