Light Emitting Device
A light-emitting device and light-emitting element technology, which is applied in optics, nonlinear optics, instruments, etc., can solve the problems that the luminous intensity cannot be reduced, and the light distribution characteristics cannot be obtained, so as to achieve the effect of suppressing light leakage
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no. 1 approach 〉
[0036] figure 1 is a schematic plan view showing the light emitting device of the first embodiment, figure 2 Yes figure 1 A schematic cross-sectional view of the A-A' line. The light-emitting device includes a substrate 25 , a light-emitting element 12 mounted on the substrate 25 and having a reflective layer 17 on its upper surface, a first translucent member 16 , and a second translucent member 20 . The first light-transmitting member 16 has a first surface 16 a in contact with a side surface of the light emitting element 12 , and a second surface 16 b whose distance from the substrate 25 becomes shorter in a direction away from the light emitting element 12 . The second light-transmitting member 20 is in contact with the second surface 16 b of the first light-transmitting member 16 and covers the light-emitting element 12 . The refractive index α of the first light-transmitting member 16 is smaller than the refractive index β of the second light-transmitting member 20 ....
no. 2 approach 〉
[0072] In the light emitting device of this embodiment, the light emitting element 12 is not flip-chip mounted, but the insulating substrate side of the light emitting element 12 is mounted on the upper surface of the substrate 25 .
[0073] like Figure 5 As shown, the light-emitting element 12 of the present embodiment is mounted with a pair of p-side electrodes and n-side electrodes positioned above, and the respective electrodes are electrically connected via wiring portions 13 a and 13 b and wires 22 . A reflective layer 17 is formed on the surface of the light emitting element 12 on which electrodes are formed. For example, the reflective layer 17 may be formed on other portions while covering the electrodes, or the reflective film 17 may be formed on substantially the same surface with a protective film interposed therebetween and the electrodes may be formed thereon. In the present embodiment, the protective layer 15 is formed such that the opening 15S is located insi...
Embodiment 1
[0084] figure 1 and figure 2 A plan view and a cross-sectional view of a light-emitting device according to an example are shown. like figure 1 As shown, in the substrate 25 of this embodiment, the light-emitting element 12 is flip-chip mounted via the bonding member 18 so as to straddle the pair of positive and negative wiring portions 13 a and 13 b provided on the upper surface of the base body 24 . The protective layer 15 is formed in the area|region which does not electrically connect among the wiring part 13a, 13b. Reflective layer 17 is formed on the upper surface of light emitting element 12 .
[0085] The first light-transmitting member 16 is in contact with the side surface of the light-emitting element 12, and has a direction away from the light-emitting element 12 around the light-emitting element 12 and a substrate 25 in such a manner that the light-reflecting layer 17 on the upper surface of the light-emitting element 12 is exposed. The second surface 16b who...
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Abstract
Description
Claims
Application Information
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