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Method for improving uniformity of ALOx film depositing of ideal machine table

A uniformity and machine technology, applied in metal material coating process, coating, gaseous chemical plating, etc., can solve the problem of poor internal uniformity of silicon wafers, and achieve improved intra-chip uniformity, efficiency and uniform appearance. The effect of improving the uniformity and uniformity

Inactive Publication Date: 2017-12-15
EGING PHOTOVOLTAIC TECHNOLOGY CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is: in order to overcome the deficiencies in the prior art, the present invention provides a method for improving the uniformity of the ideal machine deposition ALOx film, to solve the problem of silicon wafers caused by the gas supply and carrier swing during coating. The problem of poor internal uniformity

Method used

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Embodiment Construction

[0010] A method for improving the uniformity of an ideal machine deposition ALOx film has the following steps:

[0011] a. At the beginning of the process, first control the carrier plate in the machine cavity to swing for 5 seconds;

[0012] b. Pass the process gas required for deposition into the cavity, and the carrier plate swings in the cavity, thereby depositing the ALOx coating on the silicon wafer;

[0013] c. The deposition process is completed first, stop feeding the process gas into the cavity, and the carrier plate continues to swing for 5 seconds before stopping;

[0014] d. After the carrier plate stops swinging, take out the deposited and coated silicon wafer.

[0015] The invention changes the action sequence between the swing of the carrier plate and the supply of process gas in the original process, solves the problem of poor uniformity in the chip caused by the swing of the gas supply and the carrier plate, and thus achieves the goal of improving the coatin...

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Abstract

The invention discloses a method for improving uniformity of ALOx film depositing of an ideal machine table. The method for improving the uniformity of ALOx film depositing of the ideal machine table comprises the following steps that a, a carrying plate in a cavity of the machine table is controlled to swing for 1-5s in the beginning of the technology; b, technology gas is introduced, and the carrying plate swings in the cavity, ALOx plating film is deposited on a silicon slice; c, depositing is finished, the technology gas is stopped from being introduced into the cavity, the carrying plate continues to swing for 1-5s; and d, the carrying plate is stopped to swing, and the deposited plating film silicon slice is taken. According to the method for improving the uniformity of ALOx film depositing of the ideal machine table, by changing sequence of actions of carrying plate swinging and technology gas supplying, the problem of poor within-slice uniformity caused by gas supplying and carrying plate swinging is solved, the purpose of promoting the uniformity of the carrying plate is achieved accordingly, the within-slice uniformity is improved, and solar cell efficiency and appearance uniformity are improved.

Description

technical field [0001] The invention relates to a method for improving the uniformity of an ALOx film deposited on an ideal ALD machine in a solar battery sheet manufacturing process. Background technique [0002] In the manufacturing process of solar cells, the ideal ALD machine is to deposit ALOx in the plate-on-plate ALD method. The deposition principle of the machine is: TMA first reacts with the silicon substrate and then reacts with water vapor to deposit the ALOx film on the silicon substrate; the gas is released from the upper cover The air outlet holes distributed on the plate are arranged in the order of H2O—N2—TMA—N2, and the purpose of depositing ALOx is achieved through the swing of the carrier plate in the cavity. Stop the swing and stop the air supply. At present, the sequence between the intake and shut-off of the process gas and the start and stop of the carrier plate swing often leads to poor uniformity of the coating film in the silicon wafer, because ALO...

Claims

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Application Information

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IPC IPC(8): C23C16/455C23C16/40
CPCC23C16/45525C23C16/403
Inventor 蔡新兴
Owner EGING PHOTOVOLTAIC TECHNOLOGY CO LTD
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