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A kind of manufacturing method of asymmetrical multi-plate nested collage type mixed pressure plate

A production method and asymmetric technology, applied in the direction of multilayer circuit manufacturing, circuit substrate materials, printed circuit components, etc., can solve the production cost of warped boards, reduce the production cost of circuit boards and other problems, and achieve the reduction of warped boards. Warping, increasing the amount of signal transmission, and reducing production costs

Active Publication Date: 2019-09-13
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides an asymmetric multi-plate nesting method to solve the problems that the existing various plates are easy to cause plate warping and high-frequency materials to be used in non-high-frequency areas when performing asymmetric lamination. The production method of the collage-type mixed-press board, which can prevent the bending and warping of various boards during lamination, and can be made of ordinary FR4 materials in non-high-frequency areas, reducing the production cost of circuit boards

Method used

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  • A kind of manufacturing method of asymmetrical multi-plate nested collage type mixed pressure plate
  • A kind of manufacturing method of asymmetrical multi-plate nested collage type mixed pressure plate
  • A kind of manufacturing method of asymmetrical multi-plate nested collage type mixed pressure plate

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Embodiment 1

[0028] Such as Figure 1 to Figure 4 As shown, this embodiment provides a method for manufacturing an asymmetrical multi-plate nested collage type mixed pressure panel. The mixed pressure plate includes plate one 1, plate two 2 and plate three 3 made of different materials. The manufacturing method Specific steps are as follows:

[0029] (1) Make a production board with an inner circuit:

[0030] According to the existing technology, through cutting → drilling → making inner layer circuit → cutting → window opening → pre-riveting → positioning → pressing, the three kinds of plates are pressed together to make a production board with inner layer circuit; as follows:

[0031] a. Cutting: According to the panel size 457mm×544mm, the first sheet 1, the second sheet 2, the third sheet 3, the PP sheet 14 and the PP sheet 2 are cut out;

[0032] b. Drilling: use the board edge tool hole positioning, and drill 5 graphic positioning holes 8 (including error prevention) at the corres...

Embodiment 2

[0048] This embodiment provides a method for manufacturing an asymmetrical multi-plate nested collage-type mixed laminated board. This method is basically the same as that of Embodiment 1, except that step (1) manufactures a production board with an inner circuit. Specifically as follows:

[0049] a. Cutting: According to the panel size 457mm×544mm, the plate 1, plate 2, plate 3, PP sheet 1 and PP sheet 2 are produced;

[0050] b. Drilling: Positioning with tool holes on the edge of the board, first drill out the pattern positioning holes at the corresponding positions of plate 1, plate 2, plate 3, PP sheet 1 and PP sheet 2, and then use the pattern positioning holes to position and drill out the rivets Positioning holes and pin positioning holes;

[0051] c. Making the inner layer circuit (negative film process): According to the design requirements, the three kinds of boards are positioned with different pattern positioning holes, produced by a vertical coating machine, and t...

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Abstract

The invention discloses a method for manufacturing asymmetric multiple plate nested collage type mixed laminating board, and the method comprises following steps: a plate I, a plate II, a plate III, a PP sheet I and a PP sheet II are obtained through cutting, and positioning holes are respectively drilled on corresponding position of the plate I, the plate II, the plate III, the PP sheet I and the PP sheet II; cutting and forming are performed on the plate III and the PP sheet II, and windowing is performed on positions on the plate II and the PP sheet I corresponding to the plate III; the plate II and the PP sheet I and the plate I are arranged in sequence, pre-riveting is performed through a rivet passing through a coincident positioning hole of the above three, and the windows of the plate II and the PP sheet I are coincident and form a groove; the PP sheet II and the plate III are put in the groove in sequence, and a pin is inserted in a coincident positioning hole of the plate III, the PP sheet II and the plate I to perform positioning, after laminating and following processes, a circuit board is manufactured. According to the invention, a condition of bending and warping of multiple plates in laminating can be avoided, and the production cost of the circuit board can be reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for manufacturing an asymmetrical multi-plate nested collage type mixed pressure board. Background technique [0002] The production process of circuit boards generally includes material cutting → negative film making inner layer circuit → pressing → drilling → copper sinking → full board electroplating → positive film process to make outer layer circuit → making solder mask layer → surface treatment → forming. [0003] The existing printed circuit board ladder board manufacturing method is usually made by laminating two boards in a symmetrical or asymmetrical manner, or by laminating three different boards in a symmetrical manner; However, according to actual needs, sometimes the plates of three different plates are pressed together in an asymmetric manner to form a stepped plate in the high-frequency area. However, in the prior art, there is a The fol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K1/03H05K1/02
Inventor 张国城杨润伍宋清周文涛徐琪琳翟青霞孙保玉
Owner SHENZHEN SUNTAK MULTILAYER PCB
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