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Transplant strengthening structure of multi-linkage printed circuit board

A printed circuit board and strengthening structure technology, which is applied in the structural connection of printed circuits, printed circuit components, etc., can solve problems such as board warpage or breakage, reduce board warping, improve bonding, and transplant firm and stable Effect

Inactive Publication Date: 2013-07-03
竞陆电子(昆山)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But there is following defect in such structure: because joint block and draw-in groove are ear-shaped, the shape of ear makes joint block (or draw-in groove) relatively short in the length direction of plate frame, and runs through the width direction of plate frame, and The two sub-circuit boards that are spliced ​​together are only bonded by glue, so after the sub-circuit board is affected by its own gravity or external force, it is easy to cause the two sub-circuit boards that are spliced ​​together to warp or break here

Method used

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  • Transplant strengthening structure of multi-linkage printed circuit board
  • Transplant strengthening structure of multi-linkage printed circuit board
  • Transplant strengthening structure of multi-linkage printed circuit board

Examples

Experimental program
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Effect test

Embodiment

[0014] Embodiment: A transplantation strengthening structure of a multi-connected printed circuit board, the multi-connected printed circuit board A has several sub-circuit boards 1 and board frames 2, between the sub-circuit boards and the board frames, adjacent sub-circuit boards There is a breaking line 3 for breaking between and between adjacent board frames, and there is at least one grafting area on the multi-connected printed circuit board, and the grafting area is formed after the unqualified sub-circuit board is removed, A qualified spare sub-circuit board B is arranged in the transplantation area, the spare sub-circuit board has a board frame 2, and there is a breaking line 3 for breaking between the spare sub-circuit board and its board frame, and at least one connection Groove C, the two ends of the connecting groove are respectively located in the adjacent plate frames 2 and the connecting groove passes through the breaking line between the plate frames, the connec...

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Abstract

The invention discloses a transplant strengthening structure of a multi-linkage printed circuit board. The transplant strengthening structure of the multi-linkage printed circuit board is provided with at least one connecting groove. Two ends of the connecting groove are respectively arranged inside adjacent plate frames, and the connecting groove penetrates through a break line between the plate frames and is filled with adhesive agent which is closely stuck to the connecting groove. Through the method of forming the connecting groove and filling the connecting groove with the adhesive agent, the two adjacent plate frames are further bound at the position of the break line, the combination degree is improved, raising of a plate is effectively avoided, a base plate is made to be flat without cracks, and transplant is made to be firm and stable.

Description

technical field [0001] The invention relates to a transplantation structure of a multi-connected printed circuit board, in particular to a structure capable of reducing the probability of warpage or breakage of the board. Background technique [0002] At present, the manufacturing method of printed circuit boards is usually to make a printed circuit board (PCB panel) into a multi-connected printed circuit board composed of multiple sub-circuit boards. Sometimes one or several sub-circuit boards of the multi-connected printed circuit board are unqualified. If it is applied to the assembly equipment, the program of the assembly equipment needs to be rearranged and designed. Because there are different scrapping arrangements, there will be many programs that need to be reset, resulting in many working procedures and low work efficiency; if there will be If the multi-connected printed circuit boards of unqualified sub-circuit boards are scrapped, it will cause a great waste of c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14
Inventor 李泽清
Owner 竞陆电子(昆山)有限公司
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